Thermal Processing Chamber Layout for Accurate Wafer Temperature Sensing
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Solution Overview
Problem
Existing thermal processing devices struggle to effectively measure and control workpiece temperature while maintaining a vacuum pressure and introducing process gases during thermal treatment processes.
Innovation Solution
A processing apparatus with radiative heating sources on multiple sides of the workpiece, dielectric windows to block stray radiation, and a temperature measurement system configured to measure workpiece temperature accurately, all while maintaining a vacuum and delivering process gases.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If radiative heating sources are used to heat workpieces during thermal processing, then heating efficiency is improved, but stray radiation interferes with temperature measurement
Solution Approach 1:
The heating system is segmented into multiple independent radiative heating sources positioned at different locations (front, rear, top, bottom) around the workpiece. This allows selective activation of specific heating zones and enables temperature measurement at different positions without interference from all heating sources simultaneously.
Solution Approach 2:
The temperature measurement function is extracted from the heating system by using a separate detection device that operates independently from the radiative heating sources. The measurement system detects thermal radiation emitted by the workpiece without being interfered with by the heating radiation, allowing simultaneous heating and measurement.
Solution Approach 3:
A control system acts as an intermediary between the heating sources and measurement system, coordinating their operations to minimize interference. The control system manages the timing and intensity of heating sources while the measurement system captures temperature data, resolving the conflict between heating efficiency and measurement accuracy.
2Quantity of substance
If process gases are introduced into the processing chamber, then material treatment is improved, but vacuum pressure control becomes difficult
Solution Approach 1:
The gas delivery system operates continuously to maintain a controlled atmosphere in the processing chamber. Gas is delivered at regulated flow rates to ensure continuous material treatment while the vacuum system continuously removes excess gas, maintaining pressure control throughout the thermal processing operation.
Solution Approach 2:
The system dynamically adjusts gas delivery parameters (flow rate, pressure, composition) based on processing requirements. By changing gas parameters in real-time, the system optimizes material treatment effectiveness while maintaining compatible vacuum pressure conditions for the thermal processing operation.
3Stability of the object's composition
If multiple radiative heating sources are positioned around the workpiece, then heating uniformity is improved, but device complexity increases
Solution Approach 1:
Different radiative heating sources are positioned to provide localized heating to specific regions of the workpiece (front, rear, top, bottom surfaces). Each heating source targets a particular zone, and the control system adjusts individual source intensities to achieve overall temperature uniformity across the entire workpiece, rather than using a single complex heating system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate temperature measurement and uniform heating of workpieces under controlled conditions, ensuring efficient thermal processing with maintained vacuum pressure and gas delivery.
Implementation Method 1
one or more radiative heating sources configured to heat the workpiece from the back side of the workpiece
Implementation Method 2
one or more dielectric windows disposed between the workpiece support and the one or more radiative heating sources
Implementation Method 3
a workpiece temperature measurement system configured at a temperature measurement wavelength range to obtain a temperature measurement indicative of a temperature of the back side of the workpiece
Data Source
AI summary
A processing apparatus for a thermal treatment of a workpiece is presented. The processing apparatus includes a processing chamber, a workpiece support disposed within the processing chamber, a rotation system configured to rotate the workpiece support, a gas delivery system configured to flow one or more process gases into the processing chamber from the a first side of the processing chamber, one or more gas exhaust ports for removing gas from the processing chamber such that a vacuum pressure can be maintained, one or more radiative heating sources disposed on the second side of the processing chamber, one or more dielectric windows disposed between the workpiece support and the one or more radiative heating sources, and a workpiece temperature measurement system configured at a temperature measurement wavelength range to obtain a measurement indicative of a temperature of a back side of the workpiece.