Thermal Conduction Structures for Warpage Control in Laminated Panels
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Solution Overview
Problem
Thin laminated panels used in component carriers often exhibit warpage due to uneven temperature distribution during the heat- and pressure-assisted lamination process, leading to internal stress and reduced stiffness, which becomes more pronounced with increasing miniaturization.
Innovation Solution
The implementation of thermal conduction structures within and between panels, such as thermal vias and thermal traces, to homogenize the temperature distribution during the lamination process, ensuring even curing and reducing warpage by optimizing heat flow and temperature management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If thin panels are used for miniaturization, then component carrier size is reduced, but warpage increases due to reduced stiffness and uneven temperature distribution
Solution Approach 1:
The patent applies local quality by introducing thermal conduction structures (such as thermally conductive ink traces or embedded thermal vias) at specific locations within the panel layers. These structures are strategically positioned to address local temperature distribution issues, creating zones of enhanced thermal conductivity where needed to prevent uneven curing and warpage in thin panels.
Solution Approach 2:
The patent employs composite materials by combining thermally conductive materials (such as metal particles, carbon-based materials, or thermally conductive polymers) with the dielectric or insulating materials of the panel layers. This creates a composite structure that maintains the electrical insulation properties while adding thermal conduction capabilities to homogenize temperature distribution during lamination.
2Ease of manufacture
If conventional lamination process is used without thermal conduction structures, then manufacturing process is simple, but temperature distribution is uneven leading to warpage
Solution Approach 1:
The patent applies parameter changes by modifying the thermal conductivity parameter of the panel structure through the addition of thermal conduction structures. This changes the thermal diffusion characteristics during lamination, allowing heat to distribute more uniformly across the panel without fundamentally altering the lamination process parameters such as temperature, pressure, or time.
Solution Approach 2:
The patent uses thermal conduction structures as intermediary elements that mediate heat transfer within the panel. These structures act as thermal bridges or conduits, facilitating heat flow from hotter regions to cooler regions, thereby intermediating the temperature distribution process and preventing localized overheating or under-curing.
3Shape
If thermal conduction structures are added to homogenize temperature, then warpage is reduced, but device complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the thermal conduction function into multiple discrete structures distributed across the panel. Rather than using a single complex thermal management system, the panel is segmented into multiple simpler thermal conduction elements (such as a network of traces or distributed vias) that collectively achieve temperature homogenization through their combined effect.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in reduced warpage of component carriers by achieving uniform curing, allowing for the production of high-quality, thin panels with minimized internal stress, even as panel thickness decreases.
Implementation Method 1
a plurality of thermal conduction structures arranged in and/or at the panels
Implementation Method 2
By heating up the heating plates the temperature within the stack is increased
Data Source
Figure 1
Figure 2
Figure 3a~3c
AI summary
It is disclosed an arrangement and a method for carrying out a thermal management during a heat- and pressure-induced lamination process of panels (130) in a press book stack-up (100) for manufacturing component carriers (550). The press book stack-up (100) of the arrangement comprises (a) two heating plates (110); (b) a stack of a plurality panels (130) placed between the heating plates (110); (c) a plurality of separator sheets (120) being located between adjacent panels (130) of the stack; and (d) a plurality of thermal conduction structures (560, 660, 760) arranged in and/or at the panels (130, 530, 630, 730). The thermal conduction structures (560, 660, 760) are configured so that a spatial temperature distribution within the respective panel (130, 530, 630, 730) and/or between different panels (130, 530, 630, 730) is at least partially changed.