Thermal Dissipater Shield with Isolated Cavities

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Solution Overview

Problem

Existing heat dissipation methods for electronic devices are inefficient, leading to elevated operating temperatures due to limited thermal grease application areas, which can exceed maximum allowable temperatures and cause discomfort to users.

Innovation Solution

A thermal dissipater shield apparatus with an increased surface area that allows for the application of thermal gel to 100% of an integrated circuit's surface and surrounding areas, enhancing heat transfer efficiency by isolating components and using a canopy to dissipate heat across a larger surface, including neighboring components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the size of electronic components is decreased to improve portability, then the device becomes more portable, but heat dissipation efficiency deteriorates

Engineering Contradiction:

Improvedevice sizeVSAvoidheat dissipation efficiency

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The patent extends heat dissipation from a two-dimensional surface application to a three-dimensional volumetric approach by filling thermal grease into cavities surrounding the electronic component on multiple sides, effectively utilizing vertical and lateral dimensions to maximize thermal contact area despite the component's small size

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent creates a nested structure where the electronic component is positioned within a cavity formed by the shield apparatus, and thermal grease is nested around the component within this cavity, allowing comprehensive thermal contact from multiple directions rather than just one surface

Inventive Principle:

Principle #7Nested doll (Nesting)

2Reliability

If thermal grease application area is limited to prevent contact with surrounding components, then component isolation is maintained, but heat transfer efficiency deteriorates

Engineering Contradiction:

Improvecomponent isolationVSAvoidheat transfer efficiency

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The patent segments the device into distinct regions using a shield apparatus with cavities that isolate different components. The shield creates separate chambers for each electronic component, allowing thermal grease to be applied extensively within each isolated cavity without risking contact with neighboring components

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The shield apparatus acts as an intermediary structure that physically separates electronic components while providing dedicated cavities for thermal grease application. This mediator enables extensive thermal grease coverage around each component without the grease contacting other components, as the shield walls prevent such contact

Inventive Principle:

Principle #24Intermediary (Mediator)

3Temperature

If thermal grease is applied to 100% of integrated circuit surface, then heat transfer efficiency improves, but risk of grease contact with surrounding components increases

Engineering Contradiction:

Improveheat transfer efficiencyVSAvoidgrease contamination risk

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The patent implements preliminary isolation by constructing the shield apparatus with cavities before applying thermal grease. The cavities are pre-formed to contain the thermal grease and restrict its movement, preventing contact with surrounding components before the grease application even occurs

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The shield apparatus functions as a rigid shell structure that encloses each electronic component within a dedicated cavity. This shell confines the thermal grease within the cavity boundaries, allowing complete surface coverage of the integrated circuit while the shield walls prevent grease from escaping to contact other components

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution maintains electronic components at significantly lower temperatures than maximum operating limits, allowing for extended operation at maximum power without voltage reduction, and accelerates cooling by increasing heat transfer rates.

Implementation Method 1

a thermal dissipater shield apparatus that enables a thermal gel to be applied to substantially an entire surface area of an integrated circuit (IC) positioned on a circuit board

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP2755460B1Thermal dissipater apparatus for use with electronic devices

Publication Date: 2019.01.02 BLACKBERRY LTD

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AI summary

Thermal dissipater apparatus for use with electronic devices. An example heat dissipater apparatus disclosed herein includes a body defining a lateral wall. A first wall projects from an inner surface of the lateral wall to define a first cavity, and a second wall projects from the inner surface of the lateral wall to define a second cavity. The first wall isolates the first cavity from the second cavity.