Thermal Dissipation Element for Stacked Semiconductor Die Packages

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Solution Overview

Problem

In semiconductor device packages, the thermal dissipation path from upper semiconductor dies to the external environment is hindered due to its length, affecting the electrical performance of the upper semiconductor die(s) due to poor thermal efficiency.

Innovation Solution

A semiconductor device package design that includes a thermal dissipation element with a first portion extending parallel to the surface and a second portion perpendicular to the surface, bypassing the substrate and external stacking structure, providing a shorter and more efficient thermal conductive path.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If multiple semiconductor dies are stacked to minimize package size and improve electrical performance, then device integration and electrical performance are improved, but thermal dissipation efficiency deteriorates due to the long thermal dissipation path

Engineering Contradiction:

Improvedevice integration efficiencyVSAvoidthermal dissipation efficiency

Core Design Contradiction:

ProductivityVSTemperature

Solution Approach 1:

The thermal dissipation element extends in both planar directions (parallel to the first surface) and vertical directions (perpendicular to the first surface), creating a three-dimensional thermal conduction path. This multi-directional approach allows heat to dissipate through multiple spatial dimensions simultaneously, bypassing the limitation of purely vertical thermal paths through stacked dies and substrate.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The thermal dissipation element is divided into two functional portions: a first portion extending parallel to the first surface that is partially covered by the second die, and a second portion extending perpendicular to the first surface adjacent to the edge of the second die. This segmentation allows the element to serve dual thermal conduction functions through different spatial pathways.

Inventive Principle:

Principle #1Segmentation

2Device complexity

If a long thermal dissipation path is established through the substrate and stacked dies, then device integration is achieved, but thermal conductivity and thermal dissipation efficiency worsen

Engineering Contradiction:

Improvestacked die integrationVSAvoidthermal dissipation efficiency

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The thermal dissipation element acts as an intermediary thermal conduction structure that provides an alternative heat dissipation pathway. Instead of relying solely on the long path through the substrate and multiple die interfaces, heat can be conducted through the thermal dissipation element which extends to the edge of the second die, effectively mediating the thermal management between the stacked dies and the external environment.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Temperature

If thermal dissipation path length is reduced to improve thermal efficiency, then thermal dissipation efficiency is improved, but the ability to support multiple stacked dies and maintain electrical performance may be compromised

Engineering Contradiction:

Improvethermal dissipation efficiencyVSAvoiddevice integration capability

Core Design Contradiction:

TemperatureVSProductivity

Solution Approach 1:

The thermal dissipation element is strategically positioned with its first portion under the second die and its second portion extending adjacent to the edge of the second die. This localized placement optimizes thermal conduction efficiency by creating a shorter thermal path from the active area to the edge, while the overall package structure maintains support for multiple stacked dies and their electrical connections.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances thermal dissipation efficiency for the active surface of the second die by establishing a shorter thermal conductive path with higher thermal conductivity materials, improving the electrical performance of the semiconductor device package.

Implementation Method 1

establishing a shorter thermal conductive path with higher thermal conductivity materials

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11127650B2Semiconductor device package including thermal dissipation element and method of manufacturing the same

Publication Date: 2021.09.21 ADVANCED SEMICON ENG INC

AI summary

The present disclosure provides a semiconductor device package. The semiconductor device package includes a first die, a second die, and a thermal dissipation element. The first die has a first surface. The second die is disposed on the first surface. The thermal dissipation element is disposed on the first surface. The thermal dissipation element includes a first portion extending in a first direction substantially parallel to the first surface and partially covered by the second die and a second portion extending in a second direction substantially perpendicular to the first surface to be adjacent to an edge of the second die.