Thermal Enhanced Substrate With Deep Trenches For LED Heat Dissipation
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Solution Overview
Problem
Conventional metallic substrates for light emitting diodes (LEDs) face challenges in heat dissipation due to limited thermal conduction area, leading to overheating and increased manufacturing complexity and cost, especially when dealing with high-power LEDs that generate more heat.
Innovation Solution
A thermal enhanced substrate is fabricated by forming deep trenches in a metallic substrate to create multiple thermal conduction blocks, which are then covered with an insulating material and a metallic layer, eliminating the need for plated through holes (PTHs) and increasing the heat dissipation area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the power and working current of light emitting diodes are increased to increase brightness, then the emitting brightness is improved, but the heat generation increases causing performance compromise and potential malfunction
Solution Approach 1:
The substrate is divided into multiple thermal conduction blocks separated by deep trenches, creating multiple independent heat dissipation pathways. This segmentation allows heat to be distributed across multiple blocks rather than concentrated in a single area, effectively lowering the working temperature of the LED while maintaining high power operation for increased brightness.
2Area of stationary object
If a conventional metallic substrate with a single thermal conduction block is used, then the structure is simple, but the heat dissipation area is limited
Solution Approach 1:
Deep trenches are etched vertically into the substrate, utilizing the vertical dimension to create multiple thermal conduction blocks. This dimensional approach transforms a two-dimensional heat dissipation surface into a three-dimensional structure with multiple heat dissipation pathways, significantly increasing the effective heat dissipation area without substantially increasing the horizontal footprint of the substrate.
3Ease of manufacture
If plated through holes (PTHs) are used to electrically connect the light emitting diode to the substrate, then the electrical connection is achieved, but the manufacturing difficulty and cost increase
Solution Approach 1:
The invention extracts and eliminates the PTH structure from the substrate design. By using deep trenches to create separate thermal conduction blocks, the need for plated through holes for thermal management is removed. The electrical connection is maintained through alternative means (such as wire bonds or surface-mounted contacts), simplifying the manufacturing process while maintaining reliable electrical and thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces the working temperature of LEDs by enhancing heat dissipation and simplifies the manufacturing process, making it suitable for high-power light emitting devices and expanding their application scope.
Implementation Method 1
most heat generated by the light emitting diode 100 can be dissipated through the conduction of the thermal conduction block 112
Data Source
AI summary
A fabricating process of a thermal enhanced substrate is provided for fabricating thermal conduction blocks to increase the heat dissipation area. A metallic substrate having a first surface and a second surface opposite to the first surface is provided. A first shallow trench with a first depth is then formed on the first surface. A second shallow trench with a second depth is formed on the second surface, and a deep trench penetrating the first shallow trench and the second shallow trench is formed, where the metallic substrate is separated into many thermal conduction blocks by the deep trench. At least one metallic layer and at least one insulating material are laminated on the thermal conduction blocks, and the insulating material is filled into the deep trench and covers the thermal conduction blocks.