Embedded Thermal Heat Shield for IC Package
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Solution Overview
Problem
Current integrated circuit packaging systems face challenges with increasing clock rates, EMI radiation, thermal loads, and second-level assembly reliability, along with high production costs and complexity, which hinder the development of smaller, more robust, and cost-effective portable electronics.
Innovation Solution
The proposed solution involves a packaging system with a bottom integrated circuit mounted on a substrate with a peripheral thermal via, an inner heat shield connected to the thermal via, and a top integrated circuit, where the inner heat shield is positioned between the two ICs to enhance thermal performance and electromagnetic isolation, and the package encapsulation exposes the top planar portion of the heat shield only at the corners for efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional packaging structures are used, then manufacturing is simpler, but thermal performance deteriorates and EMI radiation increases
Solution Approach 1:
The patent implements a nested packaging structure where the first integrated circuit is mounted on a first substrate, the second integrated circuit is mounted on a second substrate that is attached to the first substrate, and a heat shield is positioned between the two integrated circuits. This nested arrangement allows multiple functional layers to be stacked vertically, improving thermal management and EMI shielding without significantly increasing the horizontal footprint, thus resolving the contradiction between thermal performance and structural complexity.
Solution Approach 2:
The patent introduces a heat shield as an intermediary component positioned between the first and second integrated circuits. This heat shield serves as a mediator that blocks thermal pathways and EMI radiation while maintaining the functional relationship between the two ICs. The intermediary heat shield resolves the contradiction by adding a specific structural element that improves thermal performance without requiring complete redesign of the entire packaging system.
2Adaptability or versatility
If more components are added to enhance functionality, then device capability improves, but manufacturing precision requirements increase
Solution Approach 1:
The patent employs substrates that serve multiple functions: they provide mechanical support for mounting integrated circuits, establish electrical connections through ball grid arrays, and facilitate thermal management. The first substrate and second substrate together create a unified platform that handles electrical, mechanical, and thermal requirements, reducing the need for additional specialized components and thereby maintaining manufacturing precision while enhancing device functionality.
3Area of stationary object
If compact packaging is used to reduce footprint, then device size decreases, but thermal dissipation becomes more difficult
Solution Approach 1:
The patent transitions from horizontal thermal dissipation to vertical thermal management by stacking substrates and components in the vertical dimension. The first substrate with its ball grid array and the second substrate mounted above it create vertical pathways for heat flow. This dimensional change allows compact horizontal footprint while maintaining effective thermal dissipation through the vertical stacking architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves thermal performance, reduces production costs, and increases board-level reliability by allowing even heat dissipation and electromagnetic isolation, addressing the limitations of current packaging technologies.
Implementation Method 1
a bottom integrated circuit on a bottom substrate having a peripheral thermal via connected to a peripheral thermal interconnect
Implementation Method 2
an inner heat shield, having a top planar portion, over the bottom integrated circuit with the inner heat shield connected to the peripheral thermal via
Implementation Method 3
the inner heat shield is positioned between the two ICs to enhance thermal performance
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: mounting a bottom integrated circuit on a bottom substrate having a peripheral thermal via connected to a peripheral thermal interconnect; mounting an inner heat shield, having a top planar portion, over the bottom integrated circuit with the inner heat shield connected to the peripheral thermal via; mounting a top integrated circuit over the inner heat shield; and forming a package encapsulation over the bottom integrated circuit, the inner heat shield, and the top integrated circuit with the top planar portion exposed only at each corners of a package topside of the package encapsulation.