Thermal management device and system
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Solution Overview
Problem
Current thermal management systems for high heat flux applications, such as semiconductor devices and medical tissue treatment, face challenges with high heat flux limitations, bulky designs, and slow response times, leading to inefficient temperature control and discomfort for patients.
Innovation Solution
A thermal management system incorporating a heat-transfer unit with a thermoelectric component and a two-phase heat transfer unit, allowing for precise and rapid temperature control by transitioning a working fluid between liquid and vapor phases, and using microfeatures to enhance evaporation and heat transfer without boiling or dry-out issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If conventional two-phase heat transfer systems are used to achieve high heat transfer rates, then heat dissipation capability is improved, but device size becomes large and cumbersome
Solution Approach 1:
The patent utilizes phase change of working fluid (liquid to vapor and back) to achieve high heat transfer rates in a compact form factor. The phase transition occurs within microchannels, allowing efficient heat dissipation without requiring large device volume.
Solution Approach 2:
The invention changes the physical state parameters of the working fluid through controlled heating and cooling cycles. By manipulating temperature and pressure parameters, the system achieves rapid heat transfer while maintaining a compact design suitable for semiconductor devices.
2Power
If conventional two-phase heat transfer systems are used for thermal management, then heat transfer capability is improved, but response time becomes slow
Solution Approach 1:
The system employs periodic heating and cooling cycles to achieve rapid thermal response. The working fluid undergoes repeated phase transitions in response to periodic thermal input, enabling fast modulation of heat transfer rates and achieving quick response times for thermal management.
Solution Approach 2:
The patent pre-conditions the working fluid and system components to be ready for rapid phase change responses. By maintaining the working fluid in a state ready for quick vaporization and condensation, the system achieves minimal response time when thermal management is required.
3Power
If conventional heat transfer devices are used for tissue treatment, then thermal management capability is improved, but patient comfort deteriorates due to bulky design
Solution Approach 1:
The patent employs thin-film heat transfer devices that can conform to body surfaces and contours. The flexible, thin design eliminates bulkiness while maintaining effective thermal management capability, significantly improving patient comfort during medical and aesthetic treatments.
Solution Approach 2:
The system rapidly adjusts thermal parameters to match treatment requirements and patient comfort needs. By quickly modulating temperature and heat flux parameters, the device provides effective thermal management while minimizing discomfort, enabling practical home use and treatment of sensitive body parts.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves high heat transfer rates with rapid and precise temperature control, enabling efficient cooling and heating of high heat flux applications, including medical treatments, while maintaining a compact and comfortable design.
Implementation Method 1
a thermoelectric component for heating or cooling a substrate surface
Implementation Method 2
a two-phase heat transfer unit thermally coupled to the thermoelectric component and configured to receive heat from the target material
Implementation Method 3
transitioning a working fluid between liquid and vapor phases
Implementation Method 4
using microfeatures to enhance evaporation and heat transfer without boiling or dry-out issues
Data Source
AI summary
Thermal management systems can include a thermoelectric component, a heat transfer unit, and a controller. The heat transfer unit has a chamber and microfeatures in the chamber that are positioned to receive a working fluid. The controller is configured to operate the thermoelectric component and the heat transfer unit such that the heat transfer unit cools one side of the thermoelectric component to a first temperature and the thermoelectric component changes the temperature of a target material on its other side to a second temperature which is within +/−60° C. of the first temperature within a range of 0.5 seconds to 20 seconds.