Thermal Module With Bent Heat-Absorption Ends
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Solution Overview
Problem
Conventional heat sinks suffer from low heat transfer efficiency and thermal resistance due to indirect heat transfer from the base to radiating fins, resulting in poor heat dissipation effects.
Innovation Solution
A thermal module design featuring a base with vertically extending slots and radiating fins with bent heat-absorption ends that directly contact the base, allowing for direct heat transfer from the heat-producing element to the radiating fins for efficient dissipation, reducing thermal resistance and enhancing overall heat transfer efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If radiating fins are assembled to the base via slots, then the heat sink can be manufactured and assembled, but thermal resistance occurs during heat transfer from base to radiating fins
Solution Approach 1:
The patent merges the base and radiating fins into a single integral heat sink structure, eliminating the assembly interface and associated thermal resistance. The radiating fins are directly formed from the base material, creating continuous thermal pathways for heat transfer.
Solution Approach 2:
The patent introduces thermal paste as an intermediary substance applied between the heat-producing element and the heat sink base, improving thermal contact and reducing thermal resistance at the interface.
2Device complexity
If heat is transferred indirectly from heat source via base to radiating fins, then the conventional heat sink structure can be maintained, but thermal resistance is generated reducing heat transfer efficiency
Solution Approach 1:
The patent combines the base and radiating fins into one integrated structure, eliminating the indirect heat transfer path through assembly interfaces. This merging removes thermal resistance barriers while maintaining structural integrity.
Solution Approach 2:
The patent segments the heat sink into functional zones with varying fin densities or structures to optimize heat transfer in different regions, improving overall thermal efficiency without requiring complex assembly.
3Ease of manufacture
If conventional heat sink structure is used, then manufacturing and assembly are straightforward, but heat dissipation effect is poor due to low heat transfer efficiency
Solution Approach 1:
The integral structure merges manufacturing steps into a single production process, eliminating separate assembly operations while simultaneously improving heat dissipation performance through direct thermal pathways.
Solution Approach 2:
The patent optimizes geometric parameters such as fin thickness, fin spacing, and base thickness to maximize heat transfer efficiency. Thermal paste application also changes the thermal conductivity parameter at the interface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces thermal resistance and improves heat transfer efficiency, providing an excellent heat dissipation effect by allowing direct heat absorption and dissipation, thereby overcoming the limitations of conventional heat sinks.
Implementation Method 1
the heat-absorption ends are in direct contact with a heat-producing element to absorb the heat produced by the latter
Implementation Method 2
the heat-dissipation ends 122, from where the heat is radiated into ambient air and diffused
Implementation Method 3
the heat-dissipation ends 122, from where the heat is radiated into ambient air and diffused
Data Source
AI summary
A thermal module is disclosed. The thermal module includes a radiating fin assembly and a base. The base has a bottom and a plurality of slot vertically extending through the base in a thickness direction thereof. The radiating fin assembly includes a plurality of radiating fins, each of which has a heat-dissipation end and a heat-absorption end. The heat-absorption ends are correspondingly extended through the slots and bent to bear on the bottom for contacting with a heat-producing element. Heat produced by the heat-producing element is absorbed by the heat-absorption ends and directly transferred from the heat-absorption ends to the heat-dissipation ends without the problem of thermal resistance. Therefore, upgraded heat transfer efficiency and excellent heat dissipation effect can be achieved with the thermal module.