Thermal Module Protrusion Apex Design for Solder Paste Retention
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Solution Overview
Problem
Conventional thermal modules face issues with solder paste being scraped off during assembly, leading to incomplete connection between the radiating fin assembly and the heat dissipation unit, which affects the module's rigidity and thermal resistance.
Innovation Solution
The thermal module design includes a heat dissipation unit with two radiating fin assemblies that have protrusion sections with sloped apices, allowing for misalignment and secure attachment by sliding and pushing the assemblies into place, ensuring the solder paste is evenly distributed and retained, thus preventing scraping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the radiating fin assembly is directly placed between the two vapor chambers and assembled tightly, then the connection is secure, but the solder paste is scraped off during assembly
Solution Approach 1:
The patent applies preliminary action by pre-forming protrusion sections with sloped apices on the radiating fin assembly before assembly. These protrusion sections are designed to guide the insertion process and control the sliding motion, preventing solder paste scraping while ensuring secure connection. The sloped surfaces are prepared in advance to facilitate the sliding entry of the radiating fin assembly between the vapor chambers without direct impact or friction that would cause solder paste loss.
2Stability of the object's composition
If the height between vapor chambers is equal to the height of radiating fin assembly, then tight connection is achieved, but solder paste is scraped off during sliding insertion
Solution Approach 1:
The patent introduces protrusion sections with sloped apices as intermediary elements between the radiating fin assembly and the vapor chambers. These protrusion sections act as mediators that control the interaction during assembly, guiding the sliding motion and distributing contact forces along the sloped surfaces. This intermediary structure prevents direct contact and friction between the vapor chambers and the solder paste, eliminating solder paste loss while maintaining assembly stability.
3Manufacturing precision
If the radiating fin assembly is slid into place during assembly, then positioning is achieved, but solder paste is scraped off by the vapor chambers
Solution Approach 1:
The patent applies preliminary action by pre-forming protrusion sections with sloped apices on the radiating fin assembly before assembly. These protrusion sections are designed to guide the insertion process and control the sliding motion, preventing solder paste scraping while ensuring secure connection. The sloped surfaces are prepared in advance to facilitate the sliding entry of the radiating fin assembly between the vapor chambers without direct impact or friction that would cause solder paste loss.
Solution Approach 2:
The patent introduces protrusion sections with sloped apices as intermediary elements between the radiating fin assembly and the vapor chambers. These protrusion sections act as mediators that control the interaction during assembly, guiding the sliding motion and distributing contact forces along the sloped surfaces. This intermediary structure prevents direct contact and friction between the vapor chambers and the solder paste, eliminating solder paste loss while maintaining assembly stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the secure assembly of the radiating fin assemblies with the heat dissipation unit, preventing solder paste loss and improving the module's rigidity and thermal performance.
Implementation Method 1
heat conduction components with good heat dissipation and conduction performance, such as heat pipes, vapor chambers and flat-plate heat pipes are often used to conduct or spread the heat
Implementation Method 2
One end of the heat pipe absorbs the heat to evaporate and convert the internal liquid working fluid into vapor working fluid
Implementation Method 3
The vapor working fluid transfers the heat to the other end of the heat pipe to achieve the heat conduction effect
Implementation Method 4
the second slope contacts the third slope and slides upward
Data Source
AI summary
A thermal module includes a heat dissipation unit having a receiving space, a first radiating fin assembly and a second radiating fin assembly. The first and second radiating fin assembles are disposed in the receiving space. At least one first protrusion section protrudes from the first radiating fin assembly. A top end of the first protrusion section is formed with a first apex. Two sides of the first apex are formed with a first slope and a second slope. At least one second protrusion section protrudes from the second radiating fin assembly corresponding to the first protrusion section. A top end of the second protrusion section is formed with a second apex. Two sides of the second apex are formed with a third slope and a fourth slope. The second apex abuts against the first apex to define an open space between the first and second radiating fin assemblies.