Thermal Resin Composition Balancing Heat Transfer and Thin Dispensing
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Solution Overview
Problem
Conventional resin compositions face limitations in achieving high thermal conductivity while maintaining thin film thickness and dischargeability, leading to challenges in efficiently dissipating heat from electronic components.
Innovation Solution
A resin composition incorporating aluminum nitride-based thermally conductive fillers with specific particle size distributions and shapes, combined with a silicone resin and platinum-based catalyst, enhances thermal conductivity and dischargeability, allowing for thin film formation and reduced thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a large amount of large particle diameter filler (100 μm or more) is used to improve thermal conductivity, then thermal conductivity increases, but film thickness cannot be reduced to 100 μm or less
Solution Approach 1:
The filler particles are segmented into multiple particle diameter ranges (0.01-100 μm, 100-500 μm, 500 μm or more) with optimized proportions. This segmentation allows small particles to fill gaps between large particles, achieving high filling rates and excellent thermal conductivity while maintaining thin film formation capability.
Solution Approach 2:
Different regions of the filler distribution have different characteristics - small particles (0.01-100 μm) provide good flowability and filling for thin films, while large particles (100-500 μm and above) provide high thermal conductivity. The local optimization of particle size distribution resolves the contradiction between thin film thickness and thermal conductivity.
2Length of stationary object
If filler composition is optimized for thin film formation (without large particles), then film thickness can be reduced, but filling properties deteriorate and thermal conductivity cannot be improved
Solution Approach 1:
The invention uses a composite filler system combining three distinct particle diameter ranges (0.01-100 μm, 100-500 μm, 500 μm or more) in specific proportions. This composite approach leverages the advantages of each size range: small particles ensure good flowability and thin film formation, while large particles provide high thermal conductivity, achieving both thin film thickness and excellent thermal conductivity simultaneously.
3Ease of operation
If mixing proportion of thermally conductive filler is reduced to improve dischargeability and fluidity, then dischargeability improves, but thermal conductivity cannot be improved
Solution Approach 1:
The invention optimizes the particle diameter distribution parameters of the filler, specifically setting the proportion of small particles (0.01-100 μm) at 70-90 vol% to ensure excellent dischargeability and fluidity, while incorporating large particles (100-500 μm and above) at 10-30 vol% to maintain high thermal conductivity. This parameter optimization resolves the contradiction between dischargeability and thermal conductivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves thermal conductivity of 6.0 W/m·K or more, easy dischargeability, and a thickness of 100 µm or less, effectively reducing thermal resistance and improving manufacturing efficiency for heat dissipation in electronic components.
Implementation Method 1
a resin composition including a resin and an aluminum nitride-based thermally conductive filler
Implementation Method 2
a discharge amount when the resin composition is charged into a syringe having a tip discharge portion with an inner diameter of 2 mm and discharged at a pressure of 0.62 MPa is 10 g/min or more
Implementation Method 3
a thickness of the resin composition measured after 0.02 ml of the resin composition is sandwiched between two 10 mm × 10 mm silicon chips and a force of 50 N is applied to the resin composition for 60 seconds is 100 μm or less
Data Source
Figure 1
AI summary
An object is to provide a resin composition with which an electronic component excellent in heat dissipation can be easily produced. A resin composition includes a resin and an aluminum nitride-based thermally conductive filler, wherein a thermal conductivity of the resin composition measured by a hot disk method is 6.0 W/m·K or more, wherein a discharge amount when the resin composition is charged into a syringe having a tip discharge portion with an inner diameter of 2 mm and discharged at a discharge pressure of 0.62 MPa is 10 g/min or more, and wherein a thickness of the resin composition measured after 0.02 ml thereof is sandwiched between two 10 mm × 10 mm silicon chips and a force of 50 N is applied to the resin composition for 60 seconds is 100 µm or less.