Integrated Thermal Spreader Module Base for High-Performance IC Cooling
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Solution Overview
Problem
Cooling of high-performance integrated circuits, such as MMICs, becomes increasingly difficult as they shrink and become more powerful, leading to thermal inefficiencies and structural stresses due to material mismatches in multi-layer cooling architectures, which limit thermal performance and increase costs.
Innovation Solution
An integrated module base combining a thermal spreader and heat sink, utilizing thermal pyrolytic graphite or other high thermal conductivity materials with preferentially oriented directional conductivity, and embedded low-CTE tabs to provide improved in-plane and through-plane heat conduction, reducing the need for multiple thermal interface materials and minimizing thermal resistances.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If multiple thermal interface materials and multi-layer cooling architecture are used, then thermal management capability is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines the thermal spreader and heat sink into a single integrated module base structure. The thermal spreader is formed as an integral part of the module base, eliminating the need for separate thermal interface materials and reducing the number of assembly layers while maintaining effective heat transfer from the device to the heat sink.
Solution Approach 2:
The module base structure serves multiple functions simultaneously: it provides mechanical support for the device, acts as a thermal spreader to distribute heat, and interfaces with the heat sink for heat removal. This multi-functionality reduces the need for separate dedicated thermal management components.
2Temperature
If multiple thermal interface materials are used, then thermal contact is improved, but thermal resistance increases
Solution Approach 1:
The patent removes the need for separate thermal interface materials by integrating the thermal spreader function directly into the module base structure. This eliminates additional thermal interfaces that would introduce thermal resistance, while maintaining direct thermal contact between the device and the heat sink through the integrated structure.
3Temperature
If different materials with different CTE are used in multi-layer architecture, then thermal management is improved, but structural stress increases
Solution Approach 1:
The patent uses a localized integrated structure where the thermal spreader is formed as part of the module base, allowing for optimized material selection in specific regions. This local integration reduces the number of material interfaces and minimizes CTE mismatches that would cause structural stress in a multi-layer architecture.
4Volume of moving object
If integrated module base with thermal spreader is used, then package size is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The integration of the thermal spreader into the module base reduces the overall package size by eliminating separate components and interfaces. While this integration does increase manufacturing precision requirements, the design simplifies the overall structure and reduces the number of assembly steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integrated approach enhances thermal and structural performance, reduces package size and cost, and mitigates material mismatches, achieving efficient heat removal and stress reduction while supporting near-junction thermal transport for high heat-flux devices.
Implementation Method 1
the thermal spreader configured to spread out at least some of the thermal energy received through the first encapsulation layer and to provide the spread-out thermal energy to the second encapsulation layer
Implementation Method 2
the heat sink configured to receive the thermal energy through the second encapsulation layer and to transfer the thermal energy out of the module base
Data Source
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AI summary
An apparatus includes a module base (400) configured to carry one or more devices (502) to be cooled. The module base includes a cover (100, 200, 300, 402) and a heat sink (404) connected to the cover. The cover includes first and second encapsulation layers (102-104, 202-204, 302-304) and a thermal spreader (106, 206, 306) between the encapsulation layers. The first encapsulation layer is configured to receive thermal energy from the device(s). The thermal spreader is configured to spread out at least some of the thermal energy and to provide the spread-out thermal energy to the second encapsulation layer. The heat sink is configured to receive the thermal energy through the second encapsulation layer and to transfer the thermal energy out of the module base. The first encapsulation layer includes multiple openings (108, 208, 308). The module base includes multiple tabs (110, 210, 310) inserted through the openings. Each tab is configured to provide a thermal interface between at least one of the device(s) and the thermal spreader through the first encapsulation layer.