Thermal Spreader With Overlapping Conductive Pieces
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing thermal management devices for semiconductor processing and electronics face challenges in achieving uniform heat distribution due to the use of thermally conductive cores with separate pieces that are not optimally aligned, leading to temperature gradients and fluctuations.
Innovation Solution
A thermal management device is designed with a thermal spreader layer comprising a plurality of thermally conductive pieces arranged such that their edges are closely positioned and oriented to promote uniform heat transfer. The edges can be beveled, have ship laps, or other configurations to enhance thermal coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If multiple separate thermally conductive pieces are used to form the thermal spreader layer, then the device can be manufactured more easily and accommodated to substrate contours, but temperature gradients and fluctuations occur due to non-optimal alignment and thermal coupling between pieces
Solution Approach 1:
The thermal spreader layer is divided into multiple separate thermally conductive pieces that can be manufactured independently and assembled to fit substrate contours, resolving the ease of manufacture requirement while maintaining thermal performance through optimized design
Solution Approach 2:
The edges of adjacent thermally conductive pieces are extended in the vertical dimension to create overlapping regions, transforming a 2D planar arrangement into a 3D structure that enhances thermal coupling between pieces while maintaining ease of assembly
2Temperature
If edges of adjacent thermally conductive pieces are closely positioned to promote thermal coupling, then temperature uniformity improves, but manufacturing precision requirements increase
Solution Approach 1:
By extending edges vertically to create overlapping regions, the design compensates for horizontal positioning tolerances, reducing the stringency of edge positioning precision requirements while maintaining effective thermal coupling
Solution Approach 2:
The vertically extended edge regions act as thermal intermediaries that bridge adjacent pieces, facilitating heat transfer even when horizontal spacing varies within manufacturing tolerances
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution achieves more uniform thermal conductivity and improved temperature profiles across the thermal management device, enhancing the performance and longevity of semiconductor processing and electronic systems.
Implementation Method 1
The edges of adjacent pieces are closely positioned such that they may be considered thermally coupled to promote uniform heat transfer in the planar direction of the thermal spreader layer
Data Source
AI summary
A thermal management device is provided. The thermal management device includes a first substrate, a second substrate, and a thermal spreader layer. The second substrate is arranged over the first substrate, and the thermal spreader layer is arranged between the first substrate and the second substrate. The thermal spreader layer includes a first thermally conductive piece having a first edge and a second thermally conductive piece having a first edge. The first edge of the first thermally conductive piece is disposed adjacent to the first edge of the second thermally conductive piece.