Thermal Via in Semiconductor Package for Heat Dissipation
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Solution Overview
Problem
Semiconductor device packaging faces challenges in effective heat dissipation due to the limitations of molding compounds and the metal structure of interconnect layers, which can lead to poor performance and failure of semiconductor devices, especially in packages with multiple electrically conductive layers separated by insulating layers.
Innovation Solution
The incorporation of thermal vias formed in the interconnect layers of semiconductor packages, which extend through multiple dielectric layers to provide a direct path for heat dissipation from the semiconductor die to the exterior surface, using thermally conductive materials that surpass the thermal capacity of traditional interconnects and dielectric layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional molding compound and interconnect layers are used for semiconductor packaging, then electrical connections and die protection are achieved, but heat dissipation capability is insufficient leading to poor device performance and failure
Solution Approach 1:
The patent segments the heat dissipation function from the electrical interconnect structure by introducing separate thermal via holes that penetrate through the molding compound and interconnect layers. This segmentation allows dedicated thermal pathways independent of the electrical routing, enabling effective heat removal without compromising electrical connection integrity.
Solution Approach 2:
The patent introduces thermal via holes filled with thermally conductive material as an intermediary structure between the semiconductor die and the external environment. This intermediary provides a low-thermal-resistance pathway that mediates heat transfer from the heat-generating die through the insulating molding compound and interconnect layers to external heat sinks.
2Device complexity
If multiple electrically conductive layers separated by insulating layers are used in RCP packages, then high density interconnect routing is achieved, but heat dissipation is limited by long interconnect routing and metal structure
Solution Approach 1:
The patent adds a vertical dimension to heat dissipation by creating through-molding-compound via holes that extend perpendicular to the die surface. This dimensional change allows heat to escape directly upward through the package structure, bypassing the lateral heat flow path through the interconnect layers and reducing thermal resistance without affecting the horizontal interconnect routing density.
Solution Approach 2:
The patent extracts the heat dissipation function from the electrical interconnect system by creating separate thermal via holes that are distinct from the signal and power interconnect pathways. This extraction allows the interconnect layers to maintain their complex routing for high-density electrical connections while the thermal vias provide a dedicated, simplified pathway for heat removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances heat dissipation capabilities by providing a direct and unrestricted path for heat removal from the semiconductor die, improving device performance and reliability by reducing heat buildup within the package.
Implementation Method 1
a thermally conductive material fills the opening to form a thermal via... heat can be dissipated directly from the semiconductor dies
Data Source
AI summary
A semiconductor package includes a semiconductor die having an active face and dielectric layers disposed on the active face of the semiconductor die. At least one opening is formed through the dielectric layers and extends from a non-bond pad area of the active face to an exterior surface of the dielectric layers. An electrically conductive layer is formed in the opening and is in physical contact with the active face of the semiconductor die. A thermally conductive material fills the opening to form a thermal via for dissipating heat away from the semiconductor die.