Thermally Reversible Gel Thermal Interface Materials
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Solution Overview
Problem
Conventional thermal interface materials, especially those based on silicone resin systems, are not suitable for applications requiring silicone-free, compliant, and temperature-stable solutions, as they often result in hard elastomers that are not effective gap fillers, and silicone-free alternatives suffer from similar issues like resin migration and volatility.
Innovation Solution
Development of thermal interface materials based on thermally reversible gels, such as oil gels and solvent gel resins, which include thermally conductive fillers and are formulated to soften at specific temperatures, providing a compliant and effective thermal conductivity without silicone migration or volatility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional silicone resin systems are used for thermal interface materials, then thermal conductivity can be achieved, but the materials become hard elastomers that are not effective gap fillers and exhibit resin migration and volatility
Solution Approach 1:
The patent changes the physical and chemical parameters of the base material by using oil gel or solvent gel resins instead of conventional silicone resin systems. This parameter change transforms the material from a hard elastomer to an extremely soft, compliant substance that can effectively fill gaps while maintaining thermal conductivity through the incorporation of thermally conductive fillers.
Solution Approach 2:
The patent creates composite materials by combining thermally conductive fillers with oil gel or solvent gel resin bases. This composite approach allows the material to simultaneously achieve thermal conductivity from the fillers and compliant gap-filling properties from the gel resin matrix, resolving the contradiction between thermal performance and mechanical compliance.
2Reliability
If silicone-free alternatives are used, then resin migration and volatility are reduced, but the materials become hard elastomers that are not effective gap fillers
Solution Approach 1:
The patent changes the base material parameters from hard silicone-free elastomers to extremely soft oil gel or solvent gel resins. This parameter change maintains the reliability benefit of reduced resin migration and volatility while simultaneously restoring the compliance needed for effective gap filling.
Solution Approach 2:
The patent uses oil gel or solvent gel resins as intermediary materials that bridge the gap between silicone-based materials and silicone-free alternatives. These intermediary materials provide the compliance of soft materials while maintaining the stability of silicone-free formulations, and can incorporate thermally conductive fillers to achieve thermal interface material performance.
3Ease of operation
If extremely soft elastomeric materials are used for gap filling, then compliance is improved, but thermal conductivity is reduced
Solution Approach 1:
The patent creates composite materials by dispersing thermally conductive fillers within the extremely soft oil gel or solvent gel resin matrix. This composite structure allows the material to maintain the compliance and gap-filling capability of the soft resin while the thermally conductive fillers provide the necessary thermal conductivity for heat dissipation applications.
Solution Approach 2:
The patent applies local quality by concentrating thermally conductive fillers within the soft gel matrix in specific configurations. This allows different regions of the material to have different properties - the matrix provides compliance and gap filling, while the filler regions provide thermal conductivity pathways.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermally reversible gel-based materials offer a soft, elastomeric, and temperature-stable solution with enhanced thermal conductivity, suitable for applications like fiber optics and display panels, while avoiding silicone-related issues like migration and volatility.
Implementation Method 1
thermally reversible gels, such as thermally reversible gelled fluid, oil gel and solvent gel resins
Implementation Method 2
at least one thermally conductive filler in thermally reversible gel
Data Source
AI summary
Thermal interface materials are disclosed that include or are based on thermally reversible gels, such as thermally reversible gelled fluids, oil gels and solvent gel resins. In an exemplary embodiment, a thermal interface material includes at least one thermally conductive filler in a thermally reversible gel.