Thermionic Cooling Apparatus with Nano-Fluids

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Solution Overview

Problem

Existing thermal-transfer devices, such as those relying on vapor compression refrigeration cycles, are inefficient and environmentally degrading due to mechanical components and the use of atmosphere-degrading refrigerants.

Innovation Solution

A thermal-transfer apparatus utilizing thermal energy harvesting thermionic devices with nano-fluids and thermally insulating coatings to facilitate efficient cooling by transferring electrons between emitter and collector electrodes, reducing the need for mechanical components and environmentally harmful refrigerants.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If vapor compression refrigeration cycles are used, then cooling effect is achieved, but mechanical components and atmosphere-degrading refrigerants are required

Engineering Contradiction:
Improvecooling effectVSAvoidmechanical components
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent replaces the mechanical vapor compression system with a thermionic cooling device that uses electron emission and ion transport to achieve heat pumping. The thermionic device uses electric fields and thermal fields instead of mechanical compressors and refrigerant cycles, eliminating moving parts and mechanical complexity while maintaining the cooling function.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Temperature

If vapor compression refrigeration cycles are used, then cooling effect is achieved, but environmentally degrading refrigerants are required

Engineering Contradiction:
Improvecooling effectVSAvoidatmosphere-degrading refrigerants
Core Design Contradiction:
TemperatureVSObject-affected harmful factors

Solution Approach 1:

The thermionic cooling device eliminates the need for refrigerants by using direct electron emission and ion transport through a vacuum or gas-filled gap between electrodes. The cooling effect is achieved through thermionic emission and electron heat pumping, completely removing harmful refrigerant substances from the system.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Temperature

If vapor compression refrigeration cycles are used, then cooling function is provided, but efficiency is reduced

Engineering Contradiction:
Improvecooling functionVSAvoidefficiency
Core Design Contradiction:
TemperatureVSLoss of energy

Solution Approach 1:

The patent employs nanostructured materials and optimized electrode geometries to enhance thermionic emission efficiency and electron transport. By changing the physical parameters at the nanoscale, including surface area to volume ratio and electron mean free path, the device achieves higher cooling coefficients and reduced energy losses compared to conventional macroscopic systems.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus achieves efficient cooling without mechanical components and environmentally harmful refrigerants, providing a more efficient and sustainable cooling solution compared to traditional vapor compression systems.

Implementation Method 1

The first nanoparticles are configured to transfer electrons between the first emitter electrode and the first collector electrode during operation of the apparatus to cool the first emitter electrode

Methodology Applied
Scientific EffectElectron transfer: Electron Beam

Implementation Method 2

at least one first thermal energy harvesting thermionic device positioned in a first passage extending through the first sheet

Methodology Applied
Scientific EffectThermionic emission: Thermionic Emission

Implementation Method 3

first thermally insulating coatings respectively positioned on the first opposite surfaces of the first sheet

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Implementation Method 4

The one or more first emitter-side thermal conductors are positioned adjacent to an outer surface of the first emitter electrode and in thermal communication with the first emitter electrode

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11616186B1Thermal-transfer apparatus including thermionic devices, and related methods
Publication Date: 2023.03.28 BIRMINGHAM TECHNOLOGIES INC
  • US11616186B1 patent drawing
  • US11616186B1 patent drawing
  • US11616186B1 patent drawing

AI summary

Embodiments relate to systems designed for thermal transfer augmentation and thermionic energy harvesting. Thermionic energy harvesters are configured to supply electricity for applications such as electronics, communications, and other electrical devices. Thermal transfer may be used for a variety of heating/cooling and power generation/heat recovery systems, such as, refrigeration, air conditioning, electronics cooling, industrial temperature control, waste heat recovery, off-grid and mobile refrigeration, and cold storage.