Thermocompression Bonder Lateral Force Correction
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Solution Overview
Problem
Misalignment between conductive structures in thermocompression bonding operations leads to lateral forces that can cause damage and positional errors, posing a challenge in semiconductor packaging.
Innovation Solution
A method and system for measuring lateral forces during thermocompression bonding and applying corrective motions to align conductive structures accurately, using a thermocompression bonder with a force sensor to sense and adjust for misalignment, ensuring proper alignment before applying the final bond force.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If thermocompression bonding is performed without lateral force measurement and correction, then the bonding process is simpler and faster, but misalignment between conductive structures occurs causing lateral forces and potential damage
Solution Approach 1:
The system performs preliminary lateral force measurement and corrective motion application before the final bonding operation. By detecting misalignment tendencies early and applying corrections in advance, the system prevents damage during the actual bonding process while maintaining high alignment precision.
Solution Approach 2:
The system incorporates real-time lateral force measurement during the bonding process and uses this feedback to apply corrective motions. The force sensor continuously monitors alignment status and adjusts the bonding tool position dynamically, creating a closed-loop control system that maintains precise alignment.
2Reliability
If lateral force measurement and corrective motion are applied during thermocompression bonding, then placement accuracy improves and damage is prevented, but the bonding process time increases
Solution Approach 1:
The system performs alignment correction before the critical bonding phase, ensuring reliable bonding without requiring extended correction time during the actual bonding process. This preliminary correction approach maintains high bonding reliability while minimizing impact on overall productivity.
Solution Approach 2:
The system rapidly applies corrective motions once misalignment is detected, minimizing the time spent on correction. By quickly adjusting alignment and proceeding with bonding, the system maintains high productivity while still achieving reliable bonding results through the correction mechanism.
3Ease of operation
If no corrective motion is applied during thermocompression bonding, then the process is simpler and faster, but lateral forces cause positional errors and potential damage to conductive structures
Solution Approach 1:
The system uses the harmful lateral forces as useful information by measuring them with the force sensor. These lateral forces indicate misalignment, and the measurement feedback enables corrective motions that eliminate the harmful effects while maintaining operational simplicity through automated correction.
Solution Approach 2:
The force sensor acts as an intermediary between the bonding process and the control system. It translates physical lateral forces into measurable signals that trigger corrective motions, mediating between the harmful lateral forces and the bonding operation to prevent damage while maintaining simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The approach significantly reduces lateral forces and improves placement accuracy, preventing damage to semiconductor elements and substrates by correcting initial offsets and ensuring precise alignment.
Implementation Method 1
measuring a lateral force related to contact between (i) ones of the first conductive structures and (ii) corresponding ones of the second conductive structures
Implementation Method 2
heat is applied to the semiconductor element being bonded (e.g., through a heater in a bond head assembly carrying the bond tool and/or through the support structure supporting the substrate)
Data Source
AI summary
A method of operating a thermocompression bonding system is provided. The method includes the steps of: (a) applying a first level of bond force to a semiconductor element while first conductive structures of the semiconductor element are in contact with second conductive structures of a substrate in connection with a thermocompression bonding operation; (b) measuring a lateral force related to contact between (i) ones of the first conductive structures and (ii) corresponding ones of the second conductive structures; (c) determining a corrective motion to be applied based on the lateral force measured in step (b); and (d) applying the corrective motion determined in step (c).