Thermal management system for electronic components with thermoelectric element
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Solution Overview
Problem
Conventional thermal management systems for electronic components are costly, complex, and inefficient, particularly for heating operations, as they require separate setups for cooling and heating, leading to overcrowded spaces and low efficiency.
Innovation Solution
A cooling and heating system utilizing a thermoelectric element with bidirectional current flow, controlled by an electrical circuit and a self-regulated heat transfer controller, which senses temperatures on both sides of the thermoelectric element to automatically adjust current direction for either cooling or heating, eliminating the need for external heat sources and additional components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If separate cooling and heating setups are used, then heating and cooling functions are achieved, but system complexity increases and space becomes overcrowded
Solution Approach 1:
The patent combines separate cooling and heating setups into a single integrated thermal management system. The cooling pump circulates coolant through both the cooling channel and heating channel, merging fluid circulation functions. The heater assembly integrates heating elements with the cooling structure, allowing one system to perform both heating and cooling operations without requiring duplicate infrastructure.
Solution Approach 2:
The cooling pump serves multiple functions by circulating coolant through different channels - it cools electronic components during cooling operations and removes excess heat during heating operations. The thermal management system as a whole provides both heating and cooling capabilities through a unified architecture, making the system versatile while reducing overall complexity.
2Adaptability or versatility
If separate cooling and heating setups are used, then heating and cooling operations are performed, but space requirement increases
Solution Approach 1:
The heating channel is nested within or adjacent to the cooling channel structure. The heater assembly is integrated into the cooling system framework, with heating elements positioned to utilize the same spatial envelope as the cooling infrastructure. This nested arrangement allows both heating and cooling functions to coexist in a compact configuration.
Solution Approach 2:
The patent merges the spatial requirements of cooling and heating systems by using a shared coolant circulation path and integrated structural components. The cooling pump, channels, and support structures serve both heating and cooling functions, significantly reducing the total space required compared to separate systems.
3Adaptability or versatility
If conventional heating setup is used, then heating operation is achieved, but energy efficiency decreases
Solution Approach 1:
The controller receives temperature feedback from sensors monitoring the electronic component temperature and adjusts heating power accordingly. The system modulates the heater output based on real-time temperature conditions, preventing energy waste from overheating while ensuring adequate heating when needed. This closed-loop control optimizes energy efficiency for heating operations.
Solution Approach 2:
The cooling pump operates continuously or in extended cycles, maintaining coolant flow that serves both cooling and heat removal functions. By keeping the coolant circulation active during heating operations to efficiently remove excess heat, the system maintains continuous useful thermal management action, improving overall energy efficiency compared to intermittent heating systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This system achieves self-sensing and self-regulating heat transfer, reducing complexity and cost, improving efficiency, and enabling extreme low thermal resistance, making it suitable for compact designs and outdoor applications with non-uniform heat gradients.
Implementation Method 1
a thermoelectric element with a bidirectional current flow... The thermoelectric element may be disposed between the package lid and the heatsink or inside the heatsink
Data Source
AI summary
A cooling and heating system for an electronic component comprises a thermoelectric element disposed near the electronic component and an electrical circuit for a bidirectional current, where the thermoelectric element is connected to the electrical circuit for the bidirectional current. The cooling and heating system further comprises a controller configured to control a current flow direction of the bidirectional current in the thermoelectric element to cool or heat the electronic component, where whether the electronic component is to be cooled or heated is based on the current flow direction of the bidirectional current in the thermoelectric element.