Thermoforming Flexible Circuits for 3D Surfaces

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Traditional printed circuit boards and flexible circuits face limitations in conforming to three-dimensional objects, especially in applications where space or shape constraints are present, and can deteriorate with flexing cycles.

Innovation Solution

A method of thermoforming a flexible circuit onto a three-dimensional part by applying electrically conductive lines on a thermoplastic substrate, heating it to conform to the object's shape, and attaching it using suitable techniques such as adhesives, mechanical fastening, or welding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Shape

If traditional printed circuit boards are used, then electrical circuit functionality is provided, but the circuit board cannot conform to three-dimensional shapes and space constraints

Engineering Contradiction:

Improveconformability to three-dimensional surfaceVSAvoidapplicability to space-constrained three-dimensional objects

Core Design Contradiction:

ShapeVSAdaptability or versatility

Solution Approach 1:

The patent applies a flexible substrate (thin film) instead of a rigid printed circuit board. The flexible substrate can be thermoformed to conform to three-dimensional surfaces while maintaining electrical circuit functionality through conductive traces deposited on the substrate.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The patent changes the physical state and shape parameters of the substrate by heating it to a forming temperature, allowing the substrate to be molded into three-dimensional conformal shapes. After cooling, the substrate retains the formed shape while maintaining flexibility and electrical functionality.

Inventive Principle:

Principle #35Parameter changes

2Weight of moving object

If flexible circuits are used to save weight and fit unique shapes, then weight reduction is achieved, but the circuits deteriorate after many flex cycles

Engineering Contradiction:

Improvecircuit board weightVSAvoiddurability through flex cycles

Core Design Contradiction:

Weight of moving objectVSReliability

Solution Approach 1:

The patent uses a flexible substrate made of thin film material that provides both weight reduction and flexibility. The substrate is designed to accommodate flexing movements while maintaining structural integrity and electrical circuit functionality through repeated flex cycles.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The patent employs composite construction with conductive traces deposited on the flexible substrate, creating a composite structure that combines the flexibility and light weight of thin film with the electrical conductivity of metal traces, achieving both weight savings and durability.

Inventive Principle:

Principle #40Composite materials

3Use of energy by moving object

If printed circuit boards are used for three-dimensional printed objects, then electrical functionality is provided, but sufficient planar space for attaching the circuit board is not available

Engineering Contradiction:

Improveelectrical circuit functionalityVSAvoidplanar space for circuit board attachment

Core Design Contradiction:

Use of energy by moving objectVSArea of stationary object

Solution Approach 1:

The patent transitions from two-dimensional planar circuit boards to three-dimensional conformal circuits. The flexible substrate can be formed to wrap around and conform to three-dimensional surfaces, utilizing vertical and curved dimensions rather than relying solely on planar attachment space.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The flexible substrate can be thermoformed to conform to the three-dimensional shape of the object, allowing electrical circuits to be integrated directly onto complex surfaces without requiring additional planar attachment space, as the circuit substrate becomes part of the three-dimensional form itself.

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables the creation of flexible circuits that effectively conform to and retain the shape of three-dimensional surfaces, overcoming the limitations of traditional circuits and maintaining functionality over time.

Implementation Method 1

The flexible circuit is heated to a temperature sufficient to thermoform the substrate into a shape that conforms to said three-dimensional part

Methodology Applied

Scientific EffectThermoforming: Heating

Data Source

PatentUS10165689B1Method for forming circuits for three-dimensional parts and devices formed thereby

Publication Date: 2018.12.25 GENESEE VALLEY INNOVATIONS LLC

AI summary

A process for thermoforming a circuit onto a three-dimensional part comprises applying electrically conductive lines on a substrate to form a flexible circuit. The flexible circuit is heated to a temperature sufficient to thermoform the substrate into a shape that conforms to said three-dimensional part and attached to the three-dimensional part.