Thermosetting Resin Composition for Touch Panel ITO Etching Resistance

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Solution Overview

Problem

Current resin compositions for touch panel applications lack a balance of hardness, transparency, adhesion to glass and ITO, and resistance to ITO etching solutions, particularly oxalic acid, which hinders the manufacturing efficiency and yield of touch panel devices.

Innovation Solution

A thermosetting resin composition comprising polyester amide acid, an epoxy compound with a fluorene skeleton, and an epoxy curing agent, specifically formulated to achieve a cured film with excellent adhesion to glass and ITO, high transparency, and resistance to ITO etching solutions, including oxalic acid.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If conventional resin compositions are used for transparent insulating films and overcoats, then manufacturing processes are simplified, but the cured film fails to achieve adequate adhesion to ITO and resistance to oxalic acid etching solutions

Engineering Contradiction:

Improvemanufacturing process simplificationVSAvoidadhesion to ITO and resistance to oxalic acid

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent uses a composite resin composition containing polyester amide acid (A), epoxy compound (B) with fluorene skeleton, and epoxy curing agent (C). This composite formulation combines multiple materials with complementary properties: polyester amide acid provides adhesion and flexibility, fluorene-based epoxy provides transparency and chemical resistance, and the curing agent enables crosslinking for enhanced mechanical and chemical properties. The synergistic combination resolves the contradiction by achieving both ease of manufacture and reliability simultaneously.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent specifies precise compositional parameters: polyester amide acid content of 5-50 mass%, epoxy compound (B) content of 30-80 mass%, and epoxy curing agent (C) content of 10-50 mass%. These parameter optimizations ensure the cured film achieves the required balance of adhesion to ITO, transparency, and resistance to oxalic acid etching solutions, while maintaining processability for simplified manufacturing.

Inventive Principle:

Principle #35Parameter changes

2Illumination intensity

If resin compositions are formulated for high transparency and adhesion, then optical quality and bonding improve, but resistance to ITO etching solutions deteriorates

Engineering Contradiction:

ImprovetransparencyVSAvoidresistance to oxalic acid etching solution

Core Design Contradiction:

Illumination intensityVSObject-affected harmful factors

Solution Approach 1:

The fluorene-based epoxy compound provides inherent transparency and optical clarity, while the polyester amide acid component contributes chemical resistance to oxalic acid etching solutions. The crosslinked network formed by the epoxy curing agent enhances both transparency maintenance and chemical stability. This composite approach allows the cured film to simultaneously achieve high transparency and excellent resistance to ITO etching solutions.

Inventive Principle:

Principle #40Composite materials

3Strength

If resin compositions are formulated for hardness and chemical resistance, then mechanical strength and durability improve, but transparency and adhesion to glass and ITO deteriorate

Engineering Contradiction:

Improvehardness and chemical resistanceVSAvoidtransparency

Core Design Contradiction:

StrengthVSIllumination intensity

Solution Approach 1:

The patent optimizes the content parameters within specific ranges: polyester amide acid (5-50 mass%) provides adhesion and flexibility without compromising transparency; epoxy compound (B) (30-80 mass%) ensures high transparency and chemical resistance; epoxy curing agent (10-50 mass%) achieves adequate crosslinking for hardness while maintaining optical properties. These controlled parameter changes prevent excessive hardness that would reduce transparency and adhesion.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The resin composition exhibits different functional properties in different aspects: the fluorene-based epoxy provides local transparency and chemical resistance, while polyester amide acid provides local adhesion to glass and ITO. This local quality differentiation allows the material to simultaneously achieve hardness, chemical resistance, transparency, and adhesion without mutual interference.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition enables the formation of a cured film with a well-balanced set of properties, enhancing the productivity and applicability of transparent insulating films and overcoats for touch panels, ensuring excellent adhesion and chemical resistance.

Implementation Method 1

A thermosetting resin composition comprising polyester amide acid, an epoxy compound with a fluorene skeleton, and an epoxy curing agent

Methodology Applied

Scientific EffectEpoxy curing reaction: Chemical Bonding

Implementation Method 2

resistance to ITO etching solutions, including oxalic acid

Methodology Applied

Scientific EffectChemical resistance:

Data Source

PatentUS10988616B2Thermosetting resin composition, cured film, substrate with cured film, and electronic component

Publication Date: 2021.04.27 JNC CORP

AI summary

The invention concerns a thermosetting resin composition, a cured film, a substrate with the cured film, and an electronic component, and the thermosetting resin composition contains polyester amide acid (A), epoxy compound (B) having a fluorene skeleton and epoxy curing agent (C).