Thermosetting Resin Composition for Optical Semiconductor Substrates
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Solution Overview
Problem
The challenge in manufacturing optical semiconductor devices is resin contamination during transfer molding, which hinders the mounting and wire bonding of optical semiconductor elements due to resin seepage into the substrate recess, leading to increased costs and manufacturing time.
Innovation Solution
A thermosetting resin composition with high reflectance properties, comprising a thermosetting resin component and a white pigment, is developed to prevent resin contamination, featuring a specific blending ratio of epoxy resin and curing agent, along with an oligomer with controlled viscosity and a curing agent with an isocyanuric acid backbone, which ensures reduced burr length and enhanced light reflectance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If transfer molding is performed using conventional thermosetting resin composition, then the substrate can be manufactured, but resin contamination occurs readily during molding due to resin seepage through gaps between dies
Solution Approach 1:
The patent modifies the chemical composition parameters of the thermosetting resin, specifically incorporating silane-modified epoxy resin and controlling the ratio of curing agents to resin. This chemical parameter change reduces resin fluidity and seepage tendency during molding, thereby preventing contamination while maintaining manufacturability
Solution Approach 2:
The patent uses a composite resin system combining silane-modified epoxy resin with specific curing agents (acid anhydride and/or carboxylic acid). This composite material formulation creates a resin with optimized rheological properties that resists excessive flow into mold gaps, eliminating contamination issues
2Ease of manufacture
If resin contamination is present at the opening of substrate, then a step of removing resin contamination must be added to manufacturing processes
Solution Approach 1:
The patent prevents resin contamination from occurring in the first place by optimizing the resin composition before molding. By incorporating silane-modified epoxy resin and controlling curing agent ratios, the resin maintains appropriate viscosity during molding, preventing seepage into the substrate opening and eliminating the need for subsequent removal steps
3Ease of manufacture
If resin contamination enters the opening in substrate, then mounting of optical semiconductor element is hindered
Solution Approach 1:
The patent adjusts the resin composition parameters, specifically the ratio of curing agents to epoxy resin and the incorporation of silane modification. These changes control the resin's curing characteristics and viscosity, preventing premature solidification or excessive flow that would cause contamination and mounting difficulties
4Ease of manufacture
If resin contamination obstructs electrical connection, then wire bonding is impaired
Solution Approach 1:
The patent optimizes the resin formulation by controlling the curing agent to resin ratio and using silane-modified epoxy. This creates a resin that cures at appropriate rates and maintains clean surfaces, ensuring wire bonding areas remain free of contamination and electrical connections are not obstructed
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents resin contamination, ensures excellent wire bondability, and provides resistance to thermal and light degradation, thereby improving the manufacturing efficiency and productivity of optical semiconductor devices.
Implementation Method 1
light reflectance at a wavelength of 350 nm to 800 nm, after thermal curing, is not lower than 80%
Implementation Method 2
a molding temperature of 100° C. to 200° C.
Data Source
AI summary
Disclosed is an optical semiconductor device having an optical semiconductor mounting element including a recess. On an inner side face of the recess is a thermosetting resin composition for light reflection, which, after curing, can realize high reflectance in a range of visible light to near ultraviolet light, has excellent heat deterioration resistance and tablet moldability, and is less likely to cause burrs during transfer molding, and a process for producing the resin composition, and an optical semiconductor element mounting substrate and an optical semiconductor device using the resin composition. The heat curable resin composition for light reflection comprises a heat curable component and a white pigment and is characterized in that the length of burrs caused upon transfer molding under conditions of molding temperature of 100° C. to 200° C., molding pressure of not more than 20 MPa, and molding time of 60 to 120 sec is not more than 5 mm and the light reflectance after heat curing at a wavelength of 350 nm to 800 nm is not less than 80%.