Thick-First Conductor Layer Substrate for Heat Dissipation
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Solution Overview
Problem
Current electrical circuits face challenges in heat dissipation due to the thin copper cladding on insulating metal substrates, leading to local heat buildup and increased component costs, especially during assembly where pressure and temperature stress are applied, resulting in inefficient heat spread and potential hot spots.
Innovation Solution
A prefabricated substrate with a thick first conductor layer for heat absorption and a thin second conductor layer for protection and interconnection, where components are mounted on the thick layer to facilitate efficient heat dissipation, and the substrate is produced using conventional methods without the presence of other components, allowing for improved thermal conductivity and mechanical robustness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a thin copper cladding is used on insulating metal substrate, then conductor tracks can be formed by photolithography and etching, but heat dissipation is insufficient leading to local heat buildup
Solution Approach 1:
The substrate is divided into two distinct conductor layers: a thick first conductor layer (1-10mm) for heat dissipation and a thin second conductor layer (max 300μm) for conductor track formation. This segmentation allows each layer to optimize its specific function without compromise
Solution Approach 2:
The solution transitions from a two-dimensional thin copper cladding to a three-dimensional layered structure with significant thickness variation. The first conductor layer provides vertical heat spreading capacity while the second layer maintains planar conductor track functionality
2Adaptability or versatility
If step-by-step layer attachment is used to assemble heat-dissipating components, then circuit components can be integrated, but residual air between layers creates hot spots and production becomes complex
Solution Approach 1:
The first conductor layer, dielectric, and second conductor layer are manufactured as a single integrated substrate in one production process rather than being assembled separately. This merging eliminates inter-layer air gaps that would create hot spots while maintaining all necessary circuit integration capabilities
Solution Approach 2:
The complete multi-layer substrate structure is pre-manufactured with proper bonding and air elimination before circuit components are mounted. This preliminary formation of the heat dissipation pathway ensures no hot spots are created during subsequent assembly operations
3Strength
If pressure and temperature are applied during assembly of heat-dissipating components, then layers can be bonded, but circuit components are stressed and reliability decreases
Solution Approach 1:
All high-pressure and high-temperature bonding operations are completed during substrate manufacturing before any circuit components are mounted. The substrate arrives at assembly already bonded with full mechanical strength, requiring no additional stress on sensitive components
Solution Approach 2:
The manufacturing process is segmented into two distinct phases: substrate manufacturing (with high P/T bonding) and circuit assembly (with low P/T component mounting). This separation allows optimal bonding conditions without exposing components to damaging stresses
4Ease of operation
If individual layer attachment steps are used, then flexible assembly is possible, but production costs increase due to numerous process steps
Solution Approach 1:
Multiple separate layer attachment operations are merged into a single integrated substrate manufacturing process. This eliminates numerous intermediate steps, reduces production time, and lowers costs while the final substrate maintains all necessary assembly flexibility for circuit integration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables simpler, cost-effective production with enhanced heat dissipation, reduced risk of hot spots, and increased reliability by allowing for testing of electrical breakdown strength without affecting other components, while maintaining mechanical integrity and reducing production costs.
Implementation Method 1
The first conductor layer is many times thicker than the second conductor layer and serves to absorb heat directly from a component mounted thereon, which represents a heat source and is to be cooled. Due to the high thickness of the first conductor layer, the heat generated is spread widely.
Implementation Method 2
The dielectric following the first conductor layer can transfer the widely spread heat flow with a large passage surface to the second conductor layer.
Data Source
Figure 1
AI summary
The invention relates to a method for producing an electrical circuit. A prefabricated substrate is provided, said substrate having a first and a second conductor layer and having a dielectric between the first and the second conductor layers. According to the invention, the first conductor layer is multiple times thicker than the second conductor layer. At least one component to be cooled is mounted on the first conductor layer of the prefabricated substrate, forming a heat-transferring connection between the component and the first conductor layer. The invention further relates to an electrical circuit produced in said manner. According to the invention, the electrical circuit comprises a prefabricated substrate which is produced having a first and a second conductor layer and a dielectric located therebetween. According to the invention, the first conductor layer is multiple times thicker than the second conductor layer. At least one component to be cooled is mounted on the first conductor layer. According to the invention, there is a heat-transferring connection between the component and the first conductor layer.