Thick Polyimide Film Manufacturing via Layer Lamination
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Solution Overview
Problem
Existing methods for producing polyimide films thicker than 200 μm are inefficient due to the need for low wind speeds during the drying process, limiting processing efficiency and the maximum thickness achievable to below 400 μm.
Innovation Solution
A method involving the formation of laminated structures with polyamic acid gel films, which are heated and overlapped to create a thicker polyimide film, allowing for increased wind speeds and efficient production of films up to 600 μm thickness by using a series of coating, heating, and winding steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the polyimide film thickness is increased to more than 200 μm, then the film thickness is improved, but the drying process requires low wind speed which reduces processing efficiency
Solution Approach 1:
The patent divides the thick polyimide film production into multiple thin film layers. Each layer is applied at controlled thickness, then multiple layers are stacked and laminated together to achieve the desired total thickness of 200-600 μm. This segmentation allows each individual layer to be dried at high speed while the final laminated product achieves the required thickness.
Solution Approach 2:
The patent transitions from producing a single thick film in one dimension to producing multiple thin films stacked in the vertical dimension. By applying films layer-by-layer and stacking them, the solution moves the thickness achievement from a horizontal process (single thick film) to a vertical accumulation process (multiple thin layers), thereby enabling high-speed drying while achieving great total thickness.
2Length of stationary object
If the polyimide film thickness is increased beyond 200 μm, then the film thickness capability is improved, but the maximum achievable thickness is limited to below 400 μm with existing apparatus
Solution Approach 1:
The patent uses multiple thin film applications and stackings to achieve thicknesses up to 600 μm, which exceeds the 400 μm limitation of existing single-pass apparatus. By segmenting the thickness accumulation into discrete layers that are separately processed and then laminated, the system overcomes the physical limitations of single-film deposition equipment.
Solution Approach 2:
The patent combines multiple thin polyimide films into a single thick film structure through lamination. The individual thin films, each within the capability range of existing apparatus, are merged together to create a composite structure with total thickness exceeding 400 μm, thereby achieving greater thickness than any single film could provide.
3Length of stationary object
If multiple thin films are stacked and laminated to increase thickness, then the maximum film thickness is improved, but the process complexity increases
Solution Approach 1:
The patent performs preliminary actions by applying and partially processing each thin film layer before final lamination. Each layer is prepared individually with proper drying and conditioning, then stacked and laminated in a controlled sequence. This preliminary preparation of each layer simplifies the overall lamination process and ensures consistent quality throughout the thick composite film.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the production of polyimide films with thicknesses ranging from 200 μm to 600 μm while maintaining processing efficiency, as demonstrated by examples showing improved winding speeds and film lengths.
Implementation Method 1
a polyamic acid solution may be flow-cast onto a steel strip, followed by a drying process to form a semi-solid film
Implementation Method 2
the fourth polyamic acid gel film is heated for imidization to obtain the thick polyimide film
Data Source
AI summary
A method for manufacturing a thick polyimide film includes providing a first and second laminated structures. The first and second laminated structures are heated, and the heated first and second laminated structures are wound together to form a third laminated structure. The first polyamic acid gel film of the heated first laminated structure and the second polyamic acid gel film of the heated second laminated structure are overlapped and bonded together to form a third polyamic acid gel film. Two third laminated structures are wound together to form a fourth polyamic acid gel film. A dehydration ring-closure imidization reaction is applied to the fourth polyamic acid gel film by heating to obtain the thick polyimide film. A thick polyimide film manufactured by the method is also disclosed.