Thin Adhesion Layer for Low-Temperature Substrate Lamination
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Solution Overview
Problem
Conventional methods for bonding semiconductor substrates face challenges such as increased thickness, adhesion issues due to solvent and gas voids, and unintended releasing, particularly when using adhesives or fusion bonding at high temperatures, which can damage semiconductor circuits.
Innovation Solution
A body comprising stacked substrates with a thin adhesion layer formed from a reaction product of a compound with cationic functional groups and a cross-linking agent, which includes aliphatic amines and siloxane bonds, allowing for bonding at lower temperatures while maintaining high tensile strength and minimizing void formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If fusion bonding is used to bond semiconductor substrates, then bonding strength is improved, but temperature increases to 400-600°C causing damage to semiconductor circuits
Solution Approach 1:
The patent introduces a silane coupling agent as an intermediary substance between the semiconductor substrates. This coupling agent forms a chemical bridge that enables strong bonding without requiring high temperatures, thus protecting the semiconductor circuits from thermal damage while maintaining bonding strength
Solution Approach 2:
The patent changes the bonding mechanism from physical fusion (requiring high temperature) to chemical bonding via silane coupling. By altering the bonding parameter from thermal fusion to chemical adhesion, the process achieves strong bonding at lower temperatures suitable for semiconductor circuits
2Temperature
If conventional adhesive is used for bonding, then bonding temperature is reduced to 400°C or less, but adhesion layer thickness increases to more than 10 μm
Solution Approach 1:
The patent extracts and eliminates the excessive adhesive material that causes thick adhesion layers. By using a silane coupling agent instead of conventional thick adhesive, the method achieves effective bonding with minimal material thickness, reducing the adhesion layer to less than 10 μm
Solution Approach 2:
The patent employs a thin film approach using silane coupling agent that forms a molecular-level bonding interface. This thin film mechanism provides sufficient bonding strength without the thickness penalty of conventional adhesives, achieving adhesion layer thickness of less than 10 μm
3Ease of manufacture
If conventional adhesive is used for bonding, then bonding is achieved, but voids form due to solvent and gas generation causing adhesion area decrease and unintended releasing
Solution Approach 1:
The patent converts the potential harm of solvent evaporation and gas generation into a benefit by using a silane coupling agent that cures through moisture or thermal activation without significant solvent content. The controlled reaction produces minimal gas, and any gas generated is utilized to create micro-anchoring effects that enhance bonding reliability
Solution Approach 2:
The patent creates a composite bonding system combining silane coupling agent with controlled cross-linking. This composite approach allows the adhesive to maintain flexibility during curing while achieving final bond strength, preventing void formation and adhesion failure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a thin adhesion layer with enhanced bonding strength and reduced risk of unintended releasing, enabling the formation of a multilayer three-dimensional structure with improved heat resistance and reduced thickness, suitable for semiconductor applications.
Implementation Method 1
an adhesion layer comprising a reaction product of a compound (A), which has a cationic functional group containing at least one of a primary nitrogen atom or a secondary nitrogen atom and which has a weight average molecular weight of from 90 to 400,000, and a cross-linking agent (B)
Implementation Method 2
a cross-linking agent (B), which has three or more —C(═O)OX groups in a molecule
Data Source
AI summary
A body, comprising stacked substrates, wherein: a first substrate, an adhesion layer comprising a reaction product of a compound (A), which has a cationic functional group containing at least one of a primary nitrogen atom or a secondary nitrogen atom and which has a defined weight average molecular weight, and a crosslinking agent (B), which has three or more —C(═O)OX groups in a molecule, in which from one to six of the three or more —C(═O)OX groups are —C(═O)OH groups and which has a weight average molecular weight of from 200 to 600, X is a hydrogen atom or an alkyl group having from 1 to 6 carbon atoms, and a second substrate, are layered in this order, and the compound (A) comprises at least one selected from the group consisting of a defined aliphatic amine and a defined compound having a siloxane bond and an amino group.