Thin Optical Emitter Packaging for Compact Light-Sensing Devices
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Solution Overview
Problem
Conventional optical emitters with thicknesses greater than 150 μm result in inefficient light output and larger electronic device sizes due to increased lateral light emission, while integrating smaller optical emitters with other components poses manufacturing challenges.
Innovation Solution
The electronic device incorporates a thinner optical emitter supported by an encapsulant, with a specific die configuration and interconnection structure that optimizes light output and device size, while enhancing manufacturing yield by using an interposer to accommodate the optical emitter.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional optical emitter with thickness greater than 150 μm is used, then the device structure is simpler to manufacture, but the light output efficiency decreases and the device size increases
Solution Approach 1:
The optical emitter is divided into multiple thin layers (first optical emitter layer, second optical emitter layer, third optical emitter layer) with individual thicknesses of 1-10 μm, instead of using a single thick emitter. This segmentation allows each layer to contribute to vertical light emission while minimizing lateral light loss, thereby improving light output efficiency while maintaining manufacturability through standard thin-film deposition processes
Solution Approach 2:
The patent uses a composite structure combining multiple optical emitter layers with different materials (organic light-emitting materials, inorganic light-emitting materials, or quantum dots) to achieve both thin profile and efficient light emission. The composite structure allows optimization of light emission properties while maintaining structural integrity and manufacturability
2Loss of energy
If a thinner optical emitter is used, then the light output efficiency improves and device size reduces, but the manufacturing complexity increases
Solution Approach 1:
The encapsulant serves multiple functions simultaneously: it provides mechanical support for the thin optical emitter layers, acts as a structural foundation for the electrode pattern, and serves as the base layer for the overall device architecture. This multi-functionality reduces the need for separate support structures, thereby simplifying manufacturing despite the thin emitter design
Solution Approach 2:
The electrode pattern is formed on the encapsulant before depositing the thin optical emitter layers. This preliminary action ensures that the thin emitter structure has a pre-established conductive framework in place, simplifying subsequent assembly and manufacturing steps while maintaining the benefits of thin-emitter design
3Volume of moving object
If a thinner optical emitter is used, then the device size reduces, but the optical emitter may be washed away during molding
Solution Approach 1:
The encapsulant is formed and cured before the thin optical emitter layers are deposited. This preliminary formation of a stable encapsulant structure provides a robust base that prevents the subsequent thin emitter layers from being washed away during molding processes, ensuring manufacturing reliability while maintaining small device size
Solution Approach 2:
The encapsulant acts as an intermediary layer between the substrate and the thin optical emitter layers. It provides mechanical support and protection to the fragile thin emitter structure during manufacturing processes including molding, while allowing the overall device to maintain a compact size
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the size of the electronic device, improves light output efficiency, and simplifies the manufacturing process by ensuring the optical emitter is securely positioned and not washed away during molding.
Implementation Method 1
An electronic device that includes an optical emitter and an optical sensor can be used for detecting the presence (or the bioinformation) of an object near the electronic device. The optical sensor receives or senses light emitted from the optical emitter
Implementation Method 2
The optical sensor receives or senses light emitted from the optical emitter and/or reflected by an object, thereby detecting the presence (or the bioinformation) of the object
Data Source
AI summary
An electronic device includes an encapsulant, an optical emitter, and an optical sensor. The optical sensor is encapsulated by the encapsulant. The optical emitter is supported by the encapsulant.