Thin Film Adhesion Test Component for Optoelectronic Interfaces
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Solution Overview
Problem
Current mechanical test methods are inadequate for determining the adhesion force/bond strength of thin film interfaces, particularly for embedded interfaces in optoelectronic components, as they are either qualitative, limited to surface conductive layers, or difficult to implement in high-volume production.
Innovation Solution
A method involving a substrate with optoelectronic components and a test component on a support element with pillars, where a force is applied to the test component outside its projection, allowing for the recording of force and deflection over time to determine the interface strength, using AFM or a piezo transducer for precise force application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional mechanical test methods (4-point bending, nano indentation) are used to determine adhesion force, then measurement precision can be achieved, but the method is limited to surface layers or requires electrically conductive materials and is difficult to implement in high-volume production
Solution Approach 1:
The test component is segmented into distinct functional parts: a support element with pillar structure, an interface layer representing the thin film interface, and a test component with protruding portion. This segmentation allows the adhesion test to be performed on a representative sample structure that can be manufactured using standard semiconductor fabrication processes, enabling high-volume production testing while maintaining measurement precision for embedded interfaces
Solution Approach 2:
The patent introduces an intermediary test component structure that mediates between the testing apparatus and the actual thin film interface. The test component with its protruding portion serves as an intermediary element that can be precisely manipulated by AFM or piezo transducer while representing the embedded interface conditions, thus enabling both precise measurement and compatibility with high-volume production
2Measurement precision
If AFM or piezo transducer is used to apply precise force to the test component, then measurement precision and sensitivity are improved, but device complexity increases
Solution Approach 1:
The test component structure is designed to be self-serving in terms of force application and measurement. The protruding portion of the test component naturally serves as the force application point, and the pillar structure itself serves as both the support and the interface under test. This self-service design reduces the need for complex external positioning and measurement systems, thereby reducing device complexity while maintaining measurement precision through the use of AFM or piezo transducer
Data Source
AI summary
In an embodiment a method includes providing a substrate with a plurality of optoelectronic components and at least one test component arranged on a support element on the substrate, wherein the at least one test component is adjacent to at least one of the plurality of the optoelectronic components, wherein the support element comprises a plurality of first support pillars each connected to the substrate and an interface layer arranged between the optoelectronic components and the at least one test component, respectively, and the first support pillars, the interface layer forming a top surface of the first support pillars, and wherein the at least one test component is arranged on the top surface of an associated first support pillar such that the at least one test component protrudes a projection of the top surface at least in a first direction, applying a force to the at least one test component, and determining the force applied to the at least test component and/or a deflection of the at least one test component over time.