Thin Film Multilayer Alignment Mark Formation Method
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Solution Overview
Problem
The existing method for producing thin-film multilayer devices causes damage to alignment marks due to repeated application and removal of photosensitive resist, leading to misalignment and reduced accuracy in processing.
Innovation Solution
A method where alignment marks are formed one by one, with the photosensitive resist applied and removed only once before each etching process, allowing for precise positioning of photomasks and reducing damage to alignment marks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If photolithographic etching is repeated multiple times to process thin films sequentially from the surface, then processing capability is improved, but alignment marks are damaged due to repeated application and removal of photosensitive resist
Solution Approach 1:
The patent segments the processing into distinct stages: forming all alignment marks first on the uppermost layer, then processing thin films sequentially using these pre-formed marks. This segmentation allows alignment marks to be created once rather than repeatedly, reducing damage while maintaining the ability to process multiple thin films.
Solution Approach 2:
The patent applies preliminary action by forming all alignment marks on the uppermost layer before any etching processes begin. These alignment marks are prepared in advance and used for positioning photomasks throughout subsequent etching operations, eliminating the need to reapply photosensitive resist to alignment marks multiple times.
2Manufacturing precision
If multiple alignment marks are formed on the uppermost layer for high positional accuracy, then positioning accuracy is improved, but photosensitive resist must be repeatedly applied and detached causing damage
Solution Approach 1:
The patent forms all alignment marks on the uppermost layer in advance before any etching operations. This preliminary formation allows multiple alignment marks to be created once with high positional accuracy, and then these marks are used repeatedly for positioning photomasks without requiring repeated application and removal of photosensitive resist.
Solution Approach 2:
The alignment marks formed on the uppermost layer serve as templates or copies that can be used for positioning throughout the etching process. Instead of creating new alignment marks through repeated photolithography, the same alignment marks are copied and reused for each etching step, reducing damage.
3Productivity
If alignment marks are reused multiple times for positioning, then processing efficiency is improved, but misalignment increases due to accumulated damage
Solution Approach 1:
The patent creates alignment marks in advance on the uppermost layer before any etching begins. These pre-formed marks are designed to withstand multiple uses, allowing efficient positioning of photomasks throughout the etching process without the repeated damage that would cause misalignment.
Solution Approach 2:
The patent provides beforehand cushioning by forming alignment marks with sufficient robustness on the uppermost layer to withstand multiple positioning operations. The alignment marks are created with characteristics that cushion them against damage during repeated photomask positioning, maintaining alignment accuracy throughout the etching process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances processing accuracy, allows for smaller device sizes without compromising functionality, and reduces misalignment, enabling the production of thin-film multilayer devices with improved precision and reduced size.
Implementation Method 1
a step of exposing the resist through a photomask and developing the exposed resist
Data Source
AI summary
An object of the present invention is to provide a method for producing a thin-film multilayer device, the method allowing the user to position a photomask for etching using a less-damaged alignment mark. A method according to the present invention for producing a thin-film multilayer device includes a second process in which a device section 10 and an alignment mark are formed on a thin-film multilayer body 7 through photolithographic etching and also includes a third process having a step of applying a photosensitive resist to the thin-film multilayer body 7, a step of placing a photomask having an alignment pattern on the photosensitive resist by aligning the alignment pattern with the alignment mark formed in a previous process, a step of exposing and developing the photosensitive resist, and a step of etching the thin-film multilayer body coated with the photosensitive resist to form a device section and an alignment mark on the thin-film multilayer body.