Thin Film Buffer Layer for OLED Interface Control
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Solution Overview
Problem
Existing OLED packaging technologies face challenges in achieving consistent contact surface characteristics between inorganic and organic layers due to different deposition environments, leading to issues like uneven ink diffusion and edge irregularities, which affect the overall quality of the thin film package.
Innovation Solution
A thin film package structure and method that includes a buffer layer with a thickness of 0.1 to 0.3 microns, deposited using chemical vapor deposition, and cured with oxygen-containing or fluorine-containing plasma, which is introduced differently in various areas to improve the interface characteristics and ink flow, followed by an organic layer coated via ink jet printing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a buffer layer is added between inorganic and organic layers, then interface characteristics are improved, but device structure becomes more complex
Solution Approach 1:
An organic buffer layer is introduced between the inorganic layer and the organic layer to serve as an intermediary. This buffer layer has a thickness of 0.1 to 0.3 microns and is deposited using chemical vapor deposition (PECVD). The buffer layer acts as a transition zone that improves the contact surface characteristics between the inorganic and organic layers, reducing interface differences and enhancing overall package quality.
2Manufacturing precision
If plasma is introduced during buffer layer curing, then ink flow and contact angle are improved, but process complexity increases
Solution Approach 1:
Plasma is introduced during the curing of the buffer layer to locally modify the surface properties. The plasma treatment creates different surface characteristics in different areas, which improves ink flow uniformity and contact angle control. This localized plasma treatment allows for better control of the organic layer deposition process while maintaining overall process feasibility.
3Productivity
If buffer layer thickness is reduced to 0.1-0.3 microns, then deposition time is reduced, but coating quality control becomes more difficult
Solution Approach 1:
The buffer layer thickness is optimized to a specific range of 0.1 to 0.3 microns. This parameter optimization achieves a balance between deposition time and coating quality. The thin buffer layer reduces deposition time compared to thicker layers, while the specific thickness range ensures that the buffer layer still provides adequate interface improvement and does not compromise coating quality. Chemical vapor deposition (PECVD) is used to achieve precise thickness control within this range.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces differences between the organic and inorganic layer interfaces, enhances mask cleaning, and improves the uniformity and quality of the thin film package by controlling the contact angle and ink diffusion, resulting in better packaging performance.
Implementation Method 1
chemical vapor deposition (PECVD) is used for deposition of said buffer layer
Implementation Method 2
plasma is introduced during the curing of said buffer layer; said plasma includes: oxygen-containing plasma and/or fluorine-containing plasma
Data Source
AI summary
The present disclosure discloses a thin film package structure, a thin film packaging method and a display device. The thin film package structure includes: an inorganic layer, a buffer layer and an organic layer successively covering an external of an electroluminescence unit structure from inside to outside; composition of said buffer layer is organic, and a thickness of said buffer layer is less than that of said organic layer. The thin film packaging method includes: covering a buffer layer on an inorganic layer encapsulating an electroluminescence unit structure; covering an organic layer on a surface of said buffer layer; composition of said buffer layer is organic, and a thickness of said buffer layer is less than that of said organic layer.