Thin Film Component Sheet Segmentation for Handling and Cost
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Solution Overview
Problem
The challenge is to improve handleability and reduce manufacturing costs of sheet-like electronic components used in boards with built-in electronic components, while maintaining high performance, as existing methods result in increased costs and yield losses due to material inefficiencies and positioning accuracy issues.
Innovation Solution
A thin film component sheet is developed with an interconnection layer, an insulating layer, and separated thin film electronic components, where the main surface of one electrode layer is exposed, allowing for improved handleability and reduced costs through a manufacturing method involving a carrier sheet, embedding process, and optional metal or magnetic layers for enhanced rigidity and positioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If sheet-like electronic components are manufactured with large area to ensure coverage, then manufacturing coverage is improved, but material usage efficiency deteriorates leading to increased costs
Solution Approach 1:
The electronic component sheet is divided into multiple independent thin film electronic components arranged in an array. Each component is separated by insulating material, allowing the sheet to cover large areas while using materials only where needed for actual components, thus improving material usage efficiency despite large coverage area
Solution Approach 2:
The sheet structure implements local quality by providing functional electronic components only at specific locations where needed, while other areas contain insulating material or spacing. This ensures material is not wasted in non-functional regions while maintaining the ability to cover large board areas
2Manufacturing precision
If individual electronic components are arranged separately to improve positioning accuracy, then positioning accuracy is improved, but handleability deteriorates
Solution Approach 1:
Multiple thin film electronic components are merged into a single sheet structure with a common insulating layer and interconnection layer. This allows the components to be handled as one unit (improving handleability) while maintaining precise individual positioning through the insulating material boundaries and design features (maintaining positioning accuracy)
Solution Approach 2:
The insulating layer and insulating material act as intermediaries between individual thin film electronic components. They provide physical separation and positioning references that ensure accurate placement, while the overall sheet structure provides a unified handling interface that improves ease of operation
3Ease of manufacture
If conventional sheet-like electronic components are manufactured, then manufacturing process is simplified, but manufacturing cost increases due to material waste
Solution Approach 1:
The conventional sheet-like structure is segmented into discrete thin film electronic components with insulating material between them. This segmentation allows standard manufacturing processes to be used (maintaining ease of manufacture) while eliminating material waste in non-functional areas (reducing material loss)
Solution Approach 2:
The invention changes the structural parameters of the electronic component sheet by introducing insulating material layers and separating components with insulating spacing. This modifies the material distribution parameters to reduce waste while maintaining compatibility with existing manufacturing processes
Data Source
AI summary
A thin film component sheet includes: a conducting interconnection layer formed of a conductor; an insulating layer that is laminated on the conducting interconnection layer and is formed of an insulating material; and a plurality of thin film electronic components, each of which has a pair of first and second electrode layers and a dielectric layer provided between the first and second electrode layers, and which are arranged to be separated on the insulating layer. In a state in which a main surface of the first electrode layer in each of the plurality of thin film electronic components is exposed to an outside on a main surface of one side of the thin film component sheet, a flat surface of the main surface of the thin film component sheet is formed.