Thin-Film Neural Probes With Embedded Temperature Sensing
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Solution Overview
Problem
Existing neural and spinal probes face challenges in incorporating temperature sensors due to their small profile, particularly when utilizing thin film, flexible printed circuits.
Innovation Solution
The integration of temperature sensors, such as thermistors or thermocouples, within the thin film body of neural or spinal probes, where the sensors are disposed between insulation layers and electrically coupled via traces, allowing for precise temperature monitoring during procedures like stimulation or ablation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a temperature sensor is incorporated into a probe, then temperature monitoring capability is improved, but the probe profile becomes larger and more complex
Solution Approach 1:
The temperature sensor is nested within the existing probe structure by disposing it between the inner insulation layer and the outer insulation layer of the flexible printed circuit. This nesting approach allows the sensor to be integrated into the probe without significantly increasing its overall profile, as the sensor occupies space within the existing multi-layer insulation structure rather than adding external bulk.
Solution Approach 2:
The temperature sensor is positioned in the radial dimension between insulation layers rather than adding length to the probe shaft. This dimensional placement strategy allows temperature monitoring capability to be added without proportionally increasing the probe's insertion depth or overall complexity, as the sensor is accommodated within the cross-sectional layering of the existing probe structure.
2Length of moving object
If thin film flexible printed circuits are used, then probe flexibility and thickness are improved, but incorporating temperature sensors becomes more difficult
Solution Approach 1:
The flexible printed circuit structure serves multiple functions: it provides electrical connections for the probe, offers insulation through its layered construction, and accommodates the temperature sensor within its structure. By designing the FPC to universally serve as both the electrical interface and the sensor housing, the manufacturing process is simplified as a single structure performs multiple roles rather than requiring separate components to be assembled.
Solution Approach 2:
The temperature sensor is nested within the FPC's insulation layers, with the sensor positioned between the inner and outer insulation layers. This nesting approach allows the thin-film FPC to maintain its flexibility and thinness while still accommodating the sensor, as the sensor is integrated into the existing multi-layer construction rather than requiring additional external housing or thickening of the probe structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables real-time temperature tracking during neural or spinal procedures, optimizing the effectiveness of stimulation or ablation by identifying the optimal temperature, potentially reducing the need for post-procedure imaging techniques like MRI.
Implementation Method 1
the sensor is configured to detect a temperature
Data Source
AI summary
Electrode devices are provided having certain thin film components, including at least one thin film contact and a temperature sensor associated with the contact. The temperature sensor can be used to monitor the temperature during use of the electrode device, including during electrical stimulation or ablation. Further, the temperature sensor can be used to identify the most effective temperature for stimulation or ablation.