Thin Film Structure Manufacturing via Single Mask Planarization

The patent combines multiple photolithography processes into a single photolithography process by forming recesses of different depths in the substrate before depositing the thin films. This allows a single mask to define patterns for multiple layers simultaneously, eliminating the need for multiple separate photolithography steps and reducing process complexity while maintaining pattern formation accuracy

The patent performs preliminary action by forming recesses of different depths in the substrate before depositing the thin film layers. This pre-structured substrate topography enables subsequent single-step photolithography to create accurate patterns in multiple layers without requiring multiple masking operations, thus simplifying the overall manufacturing process

Instead of depositing thin films on protruding patterns and then attempting to flatten the surface, the patent inverts the approach by first forming recesses in the substrate and then depositing thin films that fill these recesses. This ensures that the final surface is flat while the thin films remain confined to their intended regions, preventing step differences and maintaining circuit reliability

The patent embeds thin film layers within recesses of the substrate, creating a nested structure where the thin films are contained within the recesses. This nesting approach ensures that subsequent layers are deposited on a flat surface while the embedded thin films maintain their positional accuracy, preventing disconnection and short circuits