Thin Glass Substrate Encapsulation for OLED Lifespan
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Solution Overview
Problem
The existing encapsulation methods for organic light emitting devices are inadequate in preventing moisture and oxygen permeation, which can lead to deformation and reduced lifespan of the organic material layer and electrodes, and the use of thin glass substrates is prone to breakage.
Innovation Solution
The proposed organic light emitting device features a thin glass substrate with a thickness of 0.1 mm or lower, an out-coupling film (OCF) wider than the substrate, an insulating layer, a metal pattern layer to prevent moisture and air permeation, and a sealing layer with a getter to absorb residual gases, along with a light extraction structure for improved light efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a thin glass substrate is used to reduce device thickness, then the device achieves lower thickness and flexible properties, but the substrate becomes more prone to breakage
Solution Approach 1:
The patent uses a thin glass substrate (0.1 mm or lower) as a flexible thin film structure that enables device flexibility while maintaining adequate mechanical strength through optimized thickness and structural design
Solution Approach 2:
The patent employs composite material structures including the thin glass substrate combined with encapsulation layers and functional films to compensate for the reduced mechanical strength of the thin substrate while maintaining flexibility
2Device complexity
If conventional encapsulation methods are used, then the device structure is simple, but moisture and oxygen permeation occurs leading to reduced lifespan
Solution Approach 1:
The patent uses a multilayer encapsulation structure comprising different material layers (glass substrate, encapsulation layers, sealing layers) with complementary properties to achieve superior moisture and oxygen barrier performance that prevents organic material degradation
Solution Approach 2:
The encapsulation system is divided into multiple functional segments including the glass substrate, encapsulation layers, and sealing layers with getters, where each segment performs a specific protective function to collectively enhance overall encapsulation reliability
3Illumination intensity
If the aperture ratio is increased by using top emission type, then more light is emitted, but the encapsulation complexity increases
Solution Approach 1:
The patent employs thin film encapsulation structures that are compatible with top emission configurations, allowing light to pass through the substrate while maintaining effective moisture and oxygen barrier properties without requiring complex encapsulation arrangements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the encapsulation properties, increases the lifespan of the organic material layer, protects the device from substrate breakage, and improves light efficiency by effectively blocking external air and moisture while allowing efficient light emission.
Implementation Method 1
a sealing layer with a getter to absorb residual gases
Data Source
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AI summary
The present invention relates to an organic light emitting device and a method of preparing the same. More particularly, the organic light emitting device according to the present invention includes: a substrate; an organic light emitting unit in which a first electrode, an organic material layer, and a second electrode are sequentially stacked on the substrate; and an encapsulating unit configured to seal an external side of the organic light emitting unit, in which a protecting unit is provided on at least a partial region of the substrate, on which the organic light emitting unit and the encapsulating unit are not provided, and at least a partial region in a lateral surface region of the substrate.