Thin LED Packages with High Reflectivity Cavities
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Solution Overview
Problem
Conventional LED packages are thick and prone to light failure and thermal breakdown due to inadequate die attach methods, which result in reduced brightness and increased energy consumption in display panel systems.
Innovation Solution
The development of thin LED packages with optimized components and proportions, utilizing robust die attach methods such as metal-to-metal die attach techniques, and a specialized plastic material with high reflectivity and thermal management properties to maintain brightness and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If conventional LED packages use large LED chips with small cavity depth to thickness ratios, then the package can maintain brightness specifications, but the package thickness increases and cavity depth becomes a smaller percentage of overall thickness
Solution Approach 1:
The patent changes the cavity depth to thickness ratio parameter from conventional small ratios to optimized larger ratios (cavity depth comprising a larger percentage of package thickness). This parameter change allows thinner overall packages while maintaining brightness through improved light reflection geometry
Solution Approach 2:
The patent uses high reflectivity materials in the package structure, particularly in the cavity surfaces and encapsulant materials. These composite materials with optimized optical properties enhance light reflection efficiency, allowing reduced package thickness while maintaining or improving brightness output
2Ease of manufacture
If conventional LED packages use silicone, epoxy or solder die attach methods, then the LED can be mounted in the package, but the LED becomes detached or bonding material squeezes out during operation
Solution Approach 1:
The patent employs eutectic solder die attach method which creates a permanent, reliable bond between LED and package substrate. This method eliminates the reliability issues of conventional die attach materials by using a metallurgical bonding process that prevents detachment and squeeze-out during operation
Solution Approach 2:
The patent changes the die attach methodology from mechanical bonding (silicone/epoxy) to metallurgical bonding (eutectic solder). This parameter change in the bonding mechanism fundamentally improves reliability by creating a strong, heat-resistant, and mechanically stable attachment that prevents LED detachment and material squeeze-out
3Illumination intensity
If conventional LED packages use large LED chips, then brightness specifications can be met, but the package thickness increases
Solution Approach 1:
The patent optimizes the cavity depth to thickness ratio parameter, increasing cavity depth as a percentage of overall package thickness. This geometric parameter change allows the use of smaller LED chips in thinner packages while maintaining brightness through enhanced light reflection and extraction efficiency
Solution Approach 2:
The patent employs high reflectivity materials in the package cavity and encapsulant to compensate for the reduced LED chip size. These materials enhance light reflection and extraction efficiency, allowing smaller chips in thinner packages to achieve the same or better brightness output than conventional large chips in thick packages
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables thinner, brighter LED packages with improved thermal management and reliability, reducing energy consumption and extending the lifespan of LED packages while maintaining industry-standard brightness levels.
Implementation Method 1
a specialized plastic material with high reflectivity and thermal management properties to maintain brightness and efficiency
Implementation Method 2
a specialized plastic material with high reflectivity and thermal management properties to maintain brightness and efficiency
Data Source
AI summary
Packages, systems and methods for light emitting devices are disclosed. An LED package in one aspect can be of various sizes and configurations and can include one or more LEDs of a size smaller than those typically provided. The LED package or packages can for example be used for backlighting or other lighting fixtures. Optimized materials and techniques can be used for the LED packages to provide energy efficiency and long lifetime.