Thin Wiring Body Structure That Preserves Conductive Layer Shape
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Solution Overview
Problem
Conventional wiring bodies for display devices face challenges in reducing thickness while maintaining the shape of the electroconductive layer, as removing the substrate layer can deform the mesh pattern, and adding a substrate to maintain shape increases the thickness.
Innovation Solution
A wiring body comprising a first resin layer with a through hole, an electroconductive layer disposed within the through hole, and a first adhesive layer covering the resin layer and the electroconductive layer from the first main surface side, which allows for reduced thickness without deforming the electroconductive layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the substrate layer is removed to reduce thickness, then the thickness of the wiring body is reduced, but the shape of the electroconductive layer is deformed
Solution Approach 1:
A resin layer is introduced as an intermediary component between the electroconductive layer and the adhesive layer. This resin layer serves as a supporting structure that maintains the shape of the electroconductive layer while enabling the removal of the substrate layer to reduce overall thickness. The resin layer acts as a mediator that provides both mechanical support and bonding functionality.
Solution Approach 2:
The resin layer functions as a thin film structure that provides mechanical support to the electroconductive layer. By using a flexible yet structurally sound resin layer, the electroconductive layer maintains its mesh pattern shape without requiring a thick substrate, thus achieving thickness reduction while preserving shape integrity.
2Shape
If a substrate layer is added to maintain the shape of the electroconductive layer, then the shape is maintained, but the thickness of the wiring body increases
Solution Approach 1:
The resin layer serves as a thin intermediary film that provides shape maintenance functionality without adding significant thickness. It mediates between the electroconductive layer and the adhesive layer, offering structural support while keeping the overall wiring body thickness minimal.
Solution Approach 2:
A thin resin film is used instead of a thick substrate layer. This thin film provides sufficient mechanical support to maintain the electroconductive layer's shape while minimizing the increase in overall thickness, achieving a balance between shape maintenance and thickness control.
3Illumination intensity
If the mesh pattern line width is reduced to improve visibility, then the visibility of the electroconductive member is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The resin layer acts as an intermediary that provides a stable foundation for forming narrow mesh pattern lines. By ensuring the resin layer has appropriate mechanical properties and surface characteristics, it enables the formation of precise, narrow conductive lines without compromising manufacturing feasibility.
Solution Approach 2:
The physical and chemical parameters of the resin layer are optimized to facilitate the formation of narrow mesh patterns. By adjusting resin viscosity, curing characteristics, and surface energy, the manufacturing process can achieve precise line width control at reduced dimensions, improving both visibility and manufacturability.
Data Source
AI summary
A wiring body includes a first resin layer having a first main surface and a second main surface and having a through hole passing from the first main surface to the second main surface, an electroconductive layer disposed in the through hole, and a first adhesive layer covering the first resin layer and the electroconductive layer from the first main surface side.