Thinned Flexible Semiconductor Elements on 3D Ophthalmic Surfaces
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Solution Overview
Problem
Existing ophthalmic devices face challenges in incorporating flexible semiconductor elements into three-dimensional shapes without compromising functionality or increasing complexity and cost, particularly in providing variable optical properties and ensuring reliable attachment to complex surfaces.
Innovation Solution
The use of thinned and flexible semiconductor elements that can be bent or deformed to conform to three-dimensional surfaces, with metallurgical contacts and electrical routing features, allowing for attachment to cylindrical, conical, and flap designs, and integration with energization elements like batteries for enhanced functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If semiconductor elements are made thinned and flexible to conform to three-dimensional surfaces, then adaptability and flexibility are improved, but manufacturing precision and reliability may deteriorate due to stress-induced defects
Solution Approach 1:
The patent applies this principle by thinning the semiconductor substrate to create a flexible element that can be deformed and conform to three-dimensional surfaces. The thinned substrate maintains sufficient structural integrity while achieving the required flexibility for non-planar applications.
Solution Approach 2:
The patent changes the physical parameter of substrate thickness to transform the mechanical properties of the semiconductor element. By reducing the thickness parameter, the substrate transitions from a rigid state to a flexible state, enabling it to adapt to complex surface geometries while maintaining manufacturing precision through controlled thinning processes.
2Length of moving object
If semiconductor elements are thinned to reduce thickness, then flexibility and compactness are improved, but strength and reliability may worsen due to increased susceptibility to stress and defects
Solution Approach 1:
The patent utilizes thin film technology to create a substrate that is thin enough to be flexible and compact, yet maintains sufficient strength through careful control of thinning processes and selection of appropriate substrate materials and structures.
Solution Approach 2:
The patent employs stress management techniques during the thinning and deformation processes to prevent stress-induced defects. By controlling the deformation rate and applying appropriate support structures during manufacturing, the patent compensates for the reduced strength inherent in thinned substrates.
3Adaptability or versatility
If flexible semiconductor elements are deformed to attach to three-dimensional surfaces, then adaptability is improved, but manufacturing complexity increases
Solution Approach 1:
The patent performs the thinning operation on the semiconductor substrate before attaching it to the three-dimensional surface. This preliminary thinning simplifies the overall manufacturing process by creating the flexible element in a controlled environment before final assembly, reducing the complexity of on-site deformation and attachment operations.
Data Source
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AI summary
Methods to form a device whereon flexible component elements are attached upon three-dimensional surfaces are described. In some aspects, the present invention includes incorporating flexible semiconductor devices onto three-dimensional surfaces with electrical contacts. In some aspects, the formed device may be incorporated in an ophthalmic device.