Thiosulfate-Containing Polymers for Low-Temperature OFET Dielectrics
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Solution Overview
Problem
Current polymer dielectric materials for organic field effect transistors (OFETs) face challenges such as high processing temperatures, poor insulating properties, and the need for thick layers, which limit their use in flexible substrates and low-voltage applications, while also requiring complex multi-layer coatings and high vacuum processes.
Innovation Solution
Development of photocurable or thermally curable thiosulfate-containing polymers with a glass transition temperature of at least 50°C, comprising organic polymer backbones with pendant thiosulfate groups and organic charge balancing cations, which can be dissolved in environmentally friendly solvents and applied as single layers at low temperatures, offering improved electrical and insulating properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional polymer dielectric materials are used, then the materials can be processed, but they require high processing temperatures which damage flexible substrates
Solution Approach 1:
The patent modifies the chemical structure of polymer dielectric materials by incorporating thiosulfate groups and charge-balancing cations, which fundamentally changes the processing temperature parameter from high (conventional) to low (below 100°C), enabling compatibility with flexible substrates while maintaining dielectric functionality
Solution Approach 2:
The invention creates composite polymer structures combining thiosulfate-containing segments with charge-balancing cations (such as imidazolium, pyridinium, or quaternary ammonium salts), forming a new class of dielectric materials that simultaneously achieve low-temperature processing and high substrate adaptability
2Reliability
If thick dielectric layers are used to improve insulating properties, then insulation performance increases, but device complexity and manufacturing complexity increase
Solution Approach 1:
The patent changes the dielectric constant parameter of the material through thiosulfate group incorporation, enabling achieving high insulating performance with thinner layers, thus reducing overall device complexity while maintaining reliability
Solution Approach 2:
The invention extracts and eliminates the need for complex multi-layer dielectric structures by using a single optimized polymer composition that provides sufficient insulation with reduced thickness, simplifying the overall device architecture
3Ease of manufacture
If conventional dielectric materials are used, then standard processing can be applied, but vacuum processes and complex coating methods are required
Solution Approach 1:
The patent modifies the solubility parameter of dielectric materials by selecting polymer backbones and side chains compatible with common organic solvents, enabling simple solution-based coating processes (spin-coating, dip-coating, spray-coating) that eliminate the need for vacuum deposition equipment and complex manufacturing procedures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
These materials enable the production of OFETs with enhanced performance, including higher dielectric constants, thermal stability, and compatibility with flexible substrates, while simplifying the manufacturing process and reducing the need for high-temperature and vacuum-based methods.
Implementation Method 1
photocurable or thermally curable thiosulfate-containing polymers
Implementation Method 2
photocurable or thermally curable thiosulfate-containing polymers
Implementation Method 3
crosslinked disulfide polymers derived from unique photocurable or thermally curable thiosulfate-containing polymers
Data Source
AI summary
A precursor dielectric composition comprises: (1) a photocurable or thermally curable thiosulfate-containing polymer that has a Tg of at least 50° C. and comprises: an organic polymer backbone comprising (a) recurring units comprising pendant thiosulfate groups; and organic charge balancing cations, (2) optionally, an electron-accepting photosensitizer component, and (3) one or more organic solvents in which the photocurable or thermally curable thiosulfate-containing polymer is dissolved or dispersed. These precursor dielectric compositions can be applied to various substrates and eventually cured to form dielectric compositions or layers for various types of electronic devices.