Three-Layer Opto-Electronic Package for High-Bandwidth Interconnects
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current communication and computing systems face limitations in processing capacity and interconnection speed due to the use of copper-based and conventional optical systems, which hinder the integration of high-speed data transfer and efficient power management within processors and memory components.
Innovation Solution
A three-layer opto-electronic engine is designed, comprising a first layer with processors and optoelectronic connectors, a second layer featuring memories and electronic components, and a third layer for power supply and external I/O, utilizing high-speed transceivers and programmable logic devices to enhance data transfer rates and power management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If copper-based interconnection systems are used in processors, then electrical connectivity is achieved, but data transfer rates are limited and power consumption increases
Solution Approach 1:
The patent replaces copper-based electrical interconnection systems with opto-electronic transceivers that use optical signals for data transmission. This substitution of electrical (mechanical) systems with optical systems enables higher data transfer rates (scaling to Terabits) while reducing power consumption, directly resolving the technical contradiction between speed and energy use.
Solution Approach 2:
The patent changes the fundamental parameter of signal transmission from electrical to optical domain. By implementing high-speed optical transceivers with multiple lanes (e.g., 12 transceivers per FPGA), the system achieves parameter changes in data transfer rate from Gbps to Terabits scale, while optical signals inherently consume less power compared to high-speed electrical signals in copper interconnects.
2Temperature
If multiple chiplets are integrated in a package, then heat dissipation is managed, but assembly complexity increases
Solution Approach 1:
The patent divides the processing system into multiple independent chiplets including FPGAs, opto-electronic transceivers, power management ICs, and memory components, each mounted on separate substrates. This segmentation allows each component to be optimized and tested independently before integration, managing heat dissipation through physical separation while the modular nature actually reduces overall assembly complexity through standardized interconnect interfaces.
Solution Approach 2:
The patent introduces intermediate substrates and interposer layers that facilitate the integration of multiple chiplets with different form factors and thermal requirements. These intermediary components provide standardized mechanical and electrical interfaces, simplifying the assembly process while enabling effective heat management through distributed thermal paths to heat sinks and cooling structures.
3Adaptability or versatility
If pluggable optical transceivers are placed at card edge, then external I/O is enabled, but integration with processor and memory in co-package is insufficient
Solution Approach 1:
The patent merges previously separate components (processors, optical transceivers, memory, and power management) into a single integrated co-package assembly. By combining high-speed optical transceivers directly with FPGAs and memory components on the same package, the system achieves both external I/O versatility through optical interfaces and high internal data bandwidth through short-distance interconnects, eliminating the need for long external cable connections.
Solution Approach 2:
The patent transitions from two-dimensional card-edge transceiver placement to a three-dimensional stacked architecture where optical transceivers, processors, and memory are vertically integrated across multiple layers. This dimensional change enables simultaneous achievement of external optical I/O capability and high-speed internal data bandwidth through vertical interconnects that provide the shortest possible links between components.
4Adaptability or versatility
If heterogeneous integration is implemented with different foundries and wafer sizes, then component flexibility is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent employs intermediate substrates and interposer technologies that act as mediators between components from different foundries with varying wafer sizes and pitch requirements. These intermediary layers provide standardized reference frames and alignment features that absorb dimensional variations, enabling heterogeneous integration of FPGAs, optical transceivers, and memory components from multiple manufacturers while maintaining the required manufacturing precision through modular stacking and reflow soldering processes.
Data Source
AI summary
The problem of low-speed interconnections and limited processing capacity is solved by using a heterogeneous integration of various components along with high-speed transceivers and processors that are coupled with memory. The opto-electronic engine 100 comprises three layers: a first layer 101 housing processors 104 and optoelectronic connectors 707 surrounding the processors; a second layer 103 connected to the first layer, featuring first memories 709A and electronic components 124 on its first surface 123 and different memories (709B) and components (126) on its second surface 125; and a third layer 105 connected to the first or second layer, possessing different electronic components (128) on its first surface 127 and distinct components (130) on its second surface 129. Each layer presents a unique set of electronic elements, allowing for diverse functionalities and interactions within the opto-electronic engine.