Three-Molded Body Semiconductor Device Crosstalk Suppression
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Solution Overview
Problem
Existing semiconductor devices with integrated light emitting and receiving elements face challenges in suppressing crosstalk between channels and maintaining high dielectric breakdown voltage, particularly when using a single-body resin encapsulation method that can lead to interface gaps and reduced insulation properties.
Innovation Solution
The semiconductor device employs a three-molded body structure with a transparent resin for internal molds and a light-blocking resin for external molds, along with a thin film of the same resin connecting the internal molds, to effectively suppress crosstalk and enhance dielectric breakdown voltage by improving adhesion and reducing current leakage paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a one-body resin encapsulation method is employed to connect two sets of light emitting element and light receiving element, then fabrication becomes easier, but crosstalk between channels cannot be suppressed
Solution Approach 1:
The encapsulation structure is divided into multiple separate resin portions, each enclosing individual light emitting elements and light receiving elements. These segmented resin portions are positioned adjacent to each other with light blocking walls between them, preventing optical crosstalk while maintaining a compact integrated structure that is relatively easy to manufacture.
Solution Approach 2:
Light blocking walls are introduced as intermediary structures between adjacent resin portions. These walls act as mediators that block light propagation between channels, preventing crosstalk while allowing the overall encapsulation structure to remain integrated and manufacturable.
2Object-generated harmful factors
If two sets of light emitting element and light receiving element are individually encapped and molded by light blocking resin, then crosstalk can be suppressed, but gap may be formed at interface between encap and mold resin and dielectric breakdown voltage may be decreased
Solution Approach 1:
The light blocking walls are integrated directly into the resin portions forming a unified encapsulation structure. This merging eliminates gaps at interfaces between separate encapsulation and mold resin, preventing dielectric breakdown while maintaining crosstalk suppression through the integrated light blocking design.
Solution Approach 2:
The encapsulation structure combines transparent resin portions for light transmission with light blocking walls made of different material properties. This composite structure achieves both crosstalk suppression through light blocking and high dielectric breakdown voltage through seamless integration, eliminating interface gaps that would compromise reliability.
3Object-generated harmful factors
If light blocking resin is used to mold individually encapped elements, then crosstalk is suppressed, but gap formation at interface reduces adhesion and increases leakage paths
Solution Approach 1:
The light blocking walls are merged with the resin portions to form a single integrated encapsulation structure. This eliminates interface gaps between separate resin components, ensuring strong adhesion throughout the structure while maintaining effective crosstalk suppression through the light blocking design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses crosstalk between channels and increases the dielectric breakdown voltage by ensuring strong adhesion between resin components and minimizing leakage paths, thereby enhancing the insulating properties and manufacturing yield of the semiconductor device.
Implementation Method 1
a light emitting element and a light receiving element built-in and transmits a signal by an optical coupling
Implementation Method 2
molded by a light blocking resin. The crosstalk can be suppressed by this method
Data Source
AI summary
A semiconductor device includes first, second, and third molded bodies. The first molded body covers a first light emitting element, a part of a lead electrically connected to the first light emitting element, a first light receiving element configured to detect a light emitted from the first light emitting element, and a part of a lead electrically connected to the first light receiving element with a first resin. The second molded body covers a second light emitting element, a part of a lead electrically connected to the second light emitting element, a second light receiving element configured to detect a light emitted from the second light emitting element, and a part of a lead electrically connected to the second light receiving element with the first resin. The third molded body molds the first and the second molded bodies as one body using a second resin.