Through-Electrode Anchored Embedded Chip Positioning

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Solution Overview

Problem

Existing methods for manufacturing electronic components with embedded semiconductor chips in resin structures often result in positional displacement of the chip due to resin filling, pressing, and solidification processes, leading to reduced positional accuracy.

Innovation Solution

The use of through-electrodes that contact multiple side surfaces of the electronic component element, along with a diffusion prevention film and additional electronic components mounted on the resin structure, to stabilize the chip's position during resin solidification and improve accuracy.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If thermosetting resin is filled and pressed in the mold, then the resin structure is formed, but positional displacement of the electronic component element occurs

Engineering Contradiction:

Improvepositional accuracy of electronic component elementVSAvoidmanufacturing process complexity

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The electronic component element is temporarily fixed to the support plate before resin filling, and through-electrodes are pre-positioned to contact the element. This preliminary positioning prevents displacement during subsequent resin filling and pressing operations, directly addressing the positional accuracy problem while maintaining manufacturing feasibility

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

Through-electrodes are introduced as intermediary elements that contact both the electronic component element and the resin structure. These electrodes act as mediators to anchor the element in position during resin filling and solidification, preventing displacement without requiring complex direct fixing mechanisms

Inventive Principle:

Principle #24Intermediary (Mediator)

2Manufacturing precision

If support plate is peeled off after solidification, then the resin structure is released, but positional displacement occurs during peeling

Engineering Contradiction:

Improvepositional accuracy of electronic component elementVSAvoidease of support plate removal

Core Design Contradiction:

Manufacturing precisionVSEase of operation

Solution Approach 1:

The support plate is completely removed (taken out) from the final product structure after serving its temporary positioning function. The through-electrodes remain embedded in the resin structure, maintaining the electronic component element's position even after support plate removal, thus achieving both ease of operation and positional accuracy

Inventive Principle:

Principle #2Taking out (Extraction)

3Manufacturing precision

If multiple through-electrodes contact different side surfaces, then positional accuracy is improved, but device complexity increases

Engineering Contradiction:

Improvepositional accuracy of electronic component elementVSAvoidnumber of through-electrodes and their arrangements

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

Through-electrodes are strategically positioned to contact different side surfaces of the electronic component element in an asymmetric arrangement. This asymmetric positioning provides effective multi-directional constraint to prevent displacement, achieving high positional accuracy without requiring a symmetrically complex structure with electrodes on all surfaces

Inventive Principle:

Principle #4Asymmetry

Data Source

PatentUS11004759B2Electronic component and method for manufacturing the same

Publication Date: 2021.05.11 MURATA MFG CO LTD

AI summary

An electronic component includes a resin structure including first and second surfaces facing each other, an electronic component element contained in the resin structure, including first and second main surfaces facing each other, and side surfaces connecting the first and second main surfaces, and being exposed to the first surface of the resin structure, and a through-electrode penetrating the resin structure to connect the first and second surfaces of the resin structure, in which the through-electrode are in contact with at least one of the side surfaces of the electronic component element.