Through-Hole Capacitor Structure for Higher Capacitance Density

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Solution Overview

Problem

There is a growing demand for capacitors with higher capacitance to meet the requirements of smaller and thinner electronic devices, while existing multilayer capacitors struggle to provide sufficient capacity without increasing size or thickness.

Innovation Solution

A capacitor design featuring a body with through-holes, internal electrodes, dielectric layers, and external electrodes, allowing for the stacking and connection of multiple capacitors in parallel or series configurations, enhancing capacitance without increasing thickness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If conventional multilayer capacitors are used, then the capacitor structure is simple and easy to manufacture, but the capacitance is insufficient for smaller and thinner electronic devices

Engineering Contradiction:

ImprovecapacitanceVSAvoidcapacitor structure

Core Design Contradiction:

Quantity of substanceVSDevice complexity

Solution Approach 1:

The capacitor is divided into multiple unit capacitors, each containing internal electrodes (first and second internal electrodes), dielectric layers, and external electrodes. Multiple unit capacitors are stacked and connected in parallel or series configurations to achieve high capacitance in a compact form factor

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Internal electrodes are nested within the body structure with through-holes, where first internal electrodes and second internal electrodes are alternately arranged and connected through conductive patterns on the body surfaces, creating a compact nested configuration that maximizes capacitance density

Inventive Principle:

Principle #7Nested doll (Nesting)

2Quantity of substance

If the size or thickness of multilayer capacitors is increased to provide sufficient capacity, then the capacitance increases, but the device becomes larger and thicker

Engineering Contradiction:

ImprovecapacitanceVSAvoidcapacitor size

Core Design Contradiction:

Quantity of substanceVSVolume of moving object

Solution Approach 1:

Instead of increasing capacitance by expanding in a single dimension (thickness), the invention stacks multiple unit capacitors in the vertical direction and connects them through conductive patterns on the body surfaces, utilizing three-dimensional space efficiently to achieve high capacitance without increasing overall device thickness

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The body is designed with through-holes that allow internal electrodes to extend through the structure, creating a porous-like configuration that increases the effective electrode surface area and capacitance density within a compact volume

Inventive Principle:

Principle #31Porous materials

Data Source

PatentUS20250210276A1Capacitor, manufacturing method thereof, and capacitor assembly using the same

Publication Date: 2025.06.26 SAMSUNG ELECTRO MECHANICS CO LTD

AI summary

A disclosed capacitor may include a body that has through-holes extending from a first surface to a second surface, a first internal electrode disposed on the inner surfaces of the body positioned inside the through-holes, on the first surface of the body, and on the second surface of the body, a dielectric layer disposed on the first internal electrode, a second internal electrode disposed on the dielectric layer, a first external electrode disposed on the first surface and connected to the first internal electrode, and a second external electrode disposed on the second surface and connected to the second internal electrode.