Through-Hole Connecting Element for Opposite Surface Circuit Alignment
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Solution Overview
Problem
The existing electronic devices with complex circuit structures, such as display and touch panels, face challenges in efficiently connecting circuits on opposite surfaces due to limitations in precision and alignment during manufacturing processes like screen printing and exposure/development, leading to potential electrical disconnects and mechanical vulnerabilities.
Innovation Solution
The implementation of a substrate with a through hole that houses a connecting element, allowing for the electrical connection between contacting elements on opposite surfaces, utilizing materials like metal glue or solder paste, and ensuring alignment through specific design features to accommodate manufacturing inaccuracies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If screen printing or exposure/development technology is used to manufacture circuits on opposite surfaces, then circuit elements can be formed, but manufacturing precision and alignment between surfaces deteriorate due to process limitations
Solution Approach 1:
The invention divides the connection path into three segments: first contacting element on first surface, connecting element through through-hole, and second contacting element on second surface. This segmentation allows each component to be optimized independently - the connecting element can be precisely positioned in the through-hole while the contacting elements are formed using standard screen printing or exposure/development processes on their respective surfaces, thereby resolving the alignment precision problem.
Solution Approach 2:
The connecting element acts as an intermediary component that bridges the two surfaces. It is disposed within the through-hole and electrically connects the first contacting element to the second contacting element. This intermediary structure compensates for manufacturing tolerances and alignment variations that occur during screen printing or exposure/development processes, ensuring reliable electrical connection despite precision limitations.
2Ease of manufacture
If conventional connection methods are used without through-holes, then manufacturing may be simpler, but reliability of electrical connection deteriorates due to potential disconnects and mechanical vulnerabilities
Solution Approach 1:
The invention transitions from planar surface connections to three-dimensional through-hole connections. The connecting element extends through the substrate thickness direction, creating a vertical connection path that is mechanically more robust and less susceptible to shear forces and thermal stress that could cause disconnects in conventional planar connections. This dimensional change significantly improves connection reliability.
Solution Approach 2:
The through-hole is formed and the connecting element is disposed within it before final circuit assembly. This preliminary preparation ensures that the connection path is established and secured before subsequent manufacturing steps, preventing potential disconnects and ensuring mechanical stability from the outset.
3Adaptability or versatility
If complex circuit structures are implemented on both surfaces, then functionality is improved, but space utilization and design flexibility deteriorate due to manufacturing constraints
Solution Approach 1:
By segmenting the circuit into components on separate surfaces connected through the substrate, the design allows independent optimization of each surface's circuit layout. The first and second circuits can be designed and manufactured separately using standard processes, then connected via the through-hole structure, enabling complex functionality without compounding manufacturing complexity.
Solution Approach 2:
The connecting element through the through-hole serves as an intermediary that enables complex dual-surface circuit architectures. It provides a reliable connection mechanism that decouples the design constraints of each surface, allowing greater design flexibility and space utilization for complex circuit functions without being constrained by single-surface manufacturing limitations.
Data Source
AI summary
An electronic device is provided. The electronic device includes a substrate, a first contacting element, a second contacting element and a connecting element. The substrate has a first surface and a second surface. The substrate has a through hole located between the first surface and the second surface. At least a part of the connecting element is disposed in the through hole. The first contacting element is disposed on the first surface. The second contacting element is disposed on the second surface. The first contacting element electrically connects the second contacting element through the connecting element.