Display Through-Hole Encapsulation With Aligned Moisture Barriers

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Solution Overview

Problem

Display devices face challenges in preventing moisture penetration through openings, which can damage the internal components and affect the reliability and longevity of the device.

Innovation Solution

The display device incorporates a substrate with an opening area featuring a through hole and a peripheral area, including a metal layer that covers the side surfaces of an organic layer, and an encapsulation layer with an inorganic layer that directly contacts the organic layer through openings, minimizing moisture penetration by forming a barrier.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If an opening area with a through hole is provided in the substrate, then the device functionality is improved (e.g., camera integration), but moisture penetration increases causing reliability degradation

Engineering Contradiction:
Improvedevice functionalityVSAvoidmoisture resistance
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The encapsulation layer is divided into multiple segments including the inorganic layer, organic layer, and capping layer with openings. Each layer provides partial protection, and the segmented structure allows selective coverage while maintaining device functionality through the opening area.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The inorganic layer acts as an intermediary barrier between the external environment and the internal components. It directly contacts the organic layer through openings and provides the primary moisture blocking function, mediating between the need for device functionality and moisture protection.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If the inorganic layer directly contacts the organic layer through openings, then moisture penetration is minimized, but the device complexity increases

Engineering Contradiction:
Improvemoisture resistanceVSAvoidlayer structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The inorganic layer is strategically positioned to directly contact the organic layer specifically at the opening areas where moisture penetration risk is highest. This localized quality enhancement provides targeted protection without requiring complex modifications throughout the entire device structure.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The encapsulation system uses a composite structure combining inorganic, organic, and capping layers. Each material contributes different properties - the inorganic layer provides moisture barrier properties, while the organic and capping layers provide structural support and additional protection, creating a synergistic composite system.

Inventive Principle:
Principle #40Composite materials

Data Source

PatentUS20230284475A1Display device
Publication Date: 2023.09.07 SAMSUNG DISPLAY CO LTD
  • US20230284475A1 patent drawing
  • US20230284475A1 patent drawing
  • US20230284475A1 patent drawing

AI summary

A display device comprises a substrate, a pixel electrode, a common electrode, an intermediate layer, a semiconductor layer, a metal layer, and an organic layer. The substrate includes an opening area, a peripheral area surrounding the opening area, and a display area surrounding the peripheral area. The pixel electrode overlaps the display area. The common electrode overlaps the pixel electrode. The intermediate layer is disposed between the pixel electrode and the common electrode and includes a light emitting layer and a functional layer. The semiconductor layer overlaps the peripheral area and is spaced from the display area. The metal layer overlaps the semiconductor layer. The organic layer is disposed between the semiconductor layer and the metal layer. The common electrode, the functional layer, and the metal layer respectively have a first opening, a second opening, a third opening overlapping each other and overlapping the semiconductor layer.