Through-Hole Interposer Layout for Fast, Dense Z-Axis Interconnects
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Solution Overview
Problem
Conventional component carriers face challenges in achieving high signal processing efficiency and effective heat management while minimizing the risk of data loss and maintaining a compact form factor, especially as integrated circuit switching speeds and transfer rates increase.
Innovation Solution
A component carrier with a stack and an interposer having a higher density of connection elements than the stack, allowing for closer mounting of active and passive components, which reduces signal transmission paths and enhances heat dissipation, and can be manufactured using materials like silicon or ceramic for the interposer and FR4 for the stack.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If conventional component carriers with laminated stacks are used, then mechanical support and electrical connection are provided, but signal transmission speed and heat dissipation efficiency are insufficient
Solution Approach 1:
The component carrier is divided into a stack portion and an interposer portion with distinct functions. The interposer segment provides high-density connection elements for fast signal transmission, while the stack segment provides mechanical support and power distribution, resolving the contradiction between speed and complexity
Solution Approach 2:
Different regions of the component carrier are assigned different properties: the interposer region has high connection density for signal processing, while the stack region has lower density for structural support. This local differentiation enables optimized signal transmission without requiring the entire structure to be complex
2Productivity
If component density is increased to improve signal processing, then transfer rates increase, but heat management becomes more difficult
Solution Approach 1:
The interposer extends the connection elements in the vertical dimension through the stack, allowing high-density connections without increasing horizontal component density. This dimensional transition enables high productivity while maintaining better heat management through the vertical architecture
3Length of stationary object
If package thickness is reduced to minimize pitch, then compact form factor is achieved, but soldering depot height becomes limiting
Solution Approach 1:
The interposer is nested within the through-hole of the stack, allowing the high-density connection structure to be contained within the existing package footprint. This nesting enables reduced package thickness while maintaining manufacturing feasibility through standardized soldering processes
Data Source
AI summary
A component carrier includes a stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure and a through hole. An interposer is located in the through hole and has a higher density of connection elements than the stack. A first component is mounted on a first main surface of the interposer and a second component is mounted on a second main surface of the interposer. The first component and the second component are connected via the interposer.