Through-Hole Metal-Plastic Retainer Ring for CMP Flatness
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Solution Overview
Problem
Existing retainer rings in semiconductor manufacturing suffer from separation and warping due to differences in material shrinkage rates and bonding forces during chemical mechanical polishing, leading to uneven substrate surface flattening and manufacturing difficulties.
Innovation Solution
A retainer ring design featuring a core part made of metal and an injection part made of engineering plastic, with through holes, cut parts, and pillar parts to enhance bonding and prevent separation and warping, integrated into a substrate polishing apparatus.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a retainer ring is formed of a metal part and a plastic part to improve wear resistance, then the flatness maintenance is improved, but the plastic part may be separated from the metal part due to friction with the polishing pad
Solution Approach 1:
The retainer ring is divided into a metal core part and a plastic injection part, with the metal core part providing structural strength and the plastic injection part providing wear resistance. The through holes in the core part allow injection material to penetrate and bond the two parts together, preventing separation while maintaining flatness.
Solution Approach 2:
The retainer ring uses a composite structure combining metal and plastic materials, each selected for their specific properties. The metal core provides mechanical strength while the plastic injection layer provides wear resistance, creating a composite component that leverages the advantages of both materials.
2Reliability
If a retainer ring is formed of a metal part and a plastic part with different materials, then wear resistance is improved, but cracks and warping occur due to difference in shrinkage rates
Solution Approach 1:
The retainer ring is segmented into a metal core part and a plastic injection part, allowing each material to be optimized for its specific function while reducing the negative effects of differential shrinkage through the through hole design that accommodates material flow and bonding.
Solution Approach 2:
The invention changes the physical and chemical parameters of the materials and their interface, specifically using through holes to modify the bonding interface characteristics. This allows the plastic injection material to penetrate and mechanically interlock with the metal core, compensating for the different shrinkage rates and preventing cracks and warping.
3Strength
If a through hole is formed in the core part to improve bonding force, then the bonding between core part and injection part is improved, but the device complexity increases
Solution Approach 1:
The core part is segmented with through holes that serve multiple functions: they allow injection material to penetrate for bonding, provide pathways for material flow during injection, and create mechanical interlocking features. This segmentation approach achieves strong bonding without requiring complex additional bonding mechanisms.
Solution Approach 2:
The through holes serve multiple functions simultaneously: they are injection channels for material flow, bonding interfaces for joining the metal core and plastic injection part, and structural features for mechanical interlocking. This multi-functionality reduces the need for additional separate components or processes.
Data Source
AI summary
A retainer ring according to one embodiment comprises: a core part formed in a ring shape and including a metal material; and an injection part formed around the core part through molding so as to surround the core part, wherein the core part may include: a core main body formed in a ring shape; and at least one through hole formed through the core main body.