Through-substrate optical vias for dual-sided IC packages
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Solution Overview
Problem
As integrated circuit devices become smaller and communication demands increase, existing technologies face challenges with signal loss and complex routing of conductive routes, particularly in achieving high-speed connectivity and thermal management within compact package substrates.
Innovation Solution
The fabrication of optical vias extending through package substrates enables the creation of dual-sided optical multiple chip packages, allowing integrated circuit devices to be attached to both sides of the substrate, thereby increasing package density and facilitating high-speed optical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive routes are used for electrical interconnects, then signal transmission is achieved, but signal loss increases significantly with higher signaling frequency and longer distance
Solution Approach 1:
The patent replaces electrical conductive routes with optical waveguides for signal transmission. Optical fibers or waveguide structures are used to transmit optical signals instead of electrical signals through metal conductors, thereby eliminating signal loss associated with high-frequency electrical interconnects and enabling lossless transmission over longer distances within the package substrate.
2Productivity
If more integrated circuit devices are added to increase package density, then communication bandwidth increases, but routing complexity of conductive routes becomes increasingly complex
Solution Approach 1:
The patent substitutes optical waveguides for electrical conductive routes to interconnect integrated circuit devices. Optical interconnects provide simpler routing paths compared to electrical traces, reducing routing complexity while enabling higher communication bandwidth to support increased package density with more devices.
3Ease of manufacture
If integrated circuit devices are attached to a single side of the package substrate, then manufacturing is simplified, but package size must increase to meet communication bandwidth requirements
Solution Approach 1:
The patent transitions from single-sided device attachment to dual-sided device attachment on the package substrate. By attaching integrated circuit devices to both the top and bottom sides of the substrate and using through-substrate optical vias for interconnection, the package density increases, allowing smaller package size while maintaining communication bandwidth requirements.
4Reliability
If parallel input/output components are used to connect integrated circuit devices, then connectivity is achieved, but reach becomes limited as package size grows
Solution Approach 1:
The patent replaces electrical parallel I/O components with optical interconnects for connecting integrated circuit devices. Optical signals can traverse longer distances with lower attenuation compared to electrical signals, thereby extending the reach of interconnections as package size increases while maintaining reliable connectivity.
Data Source
AI summary
Integrated circuit packages may be formed having at least one optical via extending from a first surface of a package substrate to an opposing second surface of the package substrate. The at least one optical via creates an optical link between the opposing surfaces of the package substrate that enables the fabrication of a dual-sided optical multiple chip package, wherein integrated circuit devices can be attached to both surfaces of the package substrate for increased package density.