Tiered Imprint Lithography Template for Non-Planar Substrates
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Solution Overview
Problem
Conventional lithographic processes face challenges in patterning complex topographies with non-planar surfaces, as they require planar exposed surfaces which are difficult to achieve or require complex processing, especially with increasing electronic component densities and elevational differences in semiconductor devices.
Innovation Solution
A template for imprint lithography featuring multiple tiers with specific depth and height variations, allowing for the patterning of formable materials on substrates with non-planar surfaces, enabling the creation of patterned resist layers without the need for extensive planarization, by using a template with complementary topography that corresponds to the substrate's elevational differences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional lithographic processes are used, then planar exposed surfaces can be achieved, but complex processing is required for non-planar substrates
Solution Approach 1:
Instead of attempting to make the substrate surface planar before lithography, the patent inverts the approach by making the lithography template itself non-planar with tiers at different elevations. This allows the template to conform to the non-planar substrate surface, eliminating the need for complex planarization processing while maintaining patterning precision.
Solution Approach 2:
The template is designed with different regions (tiers) at different elevations, where each tier corresponds to a specific elevation range on the substrate. This local adaptation allows precise patterning at each elevation level without requiring the entire substrate surface to be planar, resolving the contradiction between surface planarity and processing complexity.
2Productivity
If electronic component density is increased, then device functionality is improved, but elevational differences on the substrate increase
Solution Approach 1:
The patent addresses increasing elevational differences by transitioning from a two-dimensional planar template to a three-dimensional tiered template. The tiers extend in the vertical dimension, allowing the template to accommodate and pattern features at multiple elevations simultaneously, thus supporting higher component densities without being constrained by surface topology.
Solution Approach 2:
The template is segmented into multiple tiers, each capable of patterning features at different elevations. This segmentation allows the single template to handle complex multi-elevation substrates that result from high component density, eliminating the need for multiple separate lithography steps.
3Manufacturing precision
If planarization processing is performed, then surface flatness is improved, but process time and complexity increase
Solution Approach 1:
The non-planar template is pre-configured with tiers at different elevations before the lithography process. This preliminary preparation allows the template to directly conform to the non-planar substrate surface during imprinting, eliminating the need for time-consuming planarization processing steps while maintaining the required surface flatness for precise patterning.
Data Source
AI summary
A template for imprint lithography can include an active area that includes a plurality of tiers including a first tier and a second tier, and a first feature within the first tier or the second tier. In another embodiment, the first and second tiers include features, and the average feature depth or height within the first tier may be substantially the same as or different from the average feature depth or height within the second tier. The template can be used in imprinting a formable layer to form a patterned resist layer over a device substrate that has at least two tiers. The template and its use are well suited for device substrates having exposed surfaces at significantly different elevations, particularly where planarization would be complicated or nearly impossible to implement.