Tile Transfer Mask Etching for Precise Substrate Alignment
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Solution Overview
Problem
Existing methods for transferring tiles from donor substrates to support substrates suffer from positioning and alignment defects due to size differences and imprecision, particularly with expensive materials like III-V semiconductors, leading to edge degradation and manufacturing issues.
Innovation Solution
A method involving the placement of tiles on a support substrate with a protective mask to define a target geometry, followed by etching to correct alignment and shape using precise techniques like photolithography or ion beams.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If tiles are transferred individually using Pick and Place technique, then positioning precision can be improved, but manufacturing time and complexity increase significantly
Solution Approach 1:
The patent segments the tile transfer process into two distinct stages: first, bulk transfer of multiple tiles simultaneously using Smart Cut technology to achieve high productivity; second, selective post-positioning adjustment of individual tiles using Pick and Place for precision correction. This segmentation allows each method to optimize its strengths while compensating for weaknesses.
Solution Approach 2:
The patent performs preliminary bulk transfer of all tiles using Smart Cut technology before final positioning adjustments. This preliminary action establishes the basic tile array structure efficiently, and subsequent fine-tuning adjustments are made only where needed, rather than performing precise positioning on every tile from scratch.
2Productivity
If Smart Cut process is used to transfer entire layers, then transfer efficiency is improved, but positioning and alignment precision deteriorate due to size differences between substrates
Solution Approach 1:
The patent applies local quality by performing global bulk transfer using Smart Cut for efficiency, then applying localized post-positioning adjustments only to specific tiles that require precision correction. This allows the majority of tiles to benefit from efficient bulk transfer while individual tiles receive targeted precision adjustments where needed.
Solution Approach 2:
The patent performs partial correction rather than complete re-positioning of all tiles. After Smart Cut bulk transfer, only the necessary post-positioning adjustments are made to correct alignment errors, rather than performing full precision positioning on every tile, thus maintaining efficiency while improving precision where required.
3Loss of substance
If tiles are cut into smaller blocks to match substrate size, then material waste is reduced, but the number of transfer operations increases
Solution Approach 1:
The patent segments the donor substrate into multiple tiles using Smart Cut technology, allowing efficient utilization of the donor substrate material while managing the number of transfer operations through batch processing. This segmentation strategy optimizes material usage without excessively increasing operational complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively corrects positioning and alignment errors, ensuring precise placement and shape of tiles, suitable for microelectronics and optoelectronics applications.
Implementation Method 1
The formation of a mask comprising a protective film partially covering said tiles according to a pattern defining a target distribution and/or geometry and at least one opening extending around the protective film
Implementation Method 2
the engraving of at least one tile through the opening of the mask so as to correct the arrangement of the tiles according to the target distribution and/or geometry
Data Source
Figure 1~2C
Figure 3~4B
Figure 4C~4E
AI summary
The invention relates to a method for producing a structure comprising at least two tiles on a substrate, said method comprising: - placing, on a support substrate (1, 3, S), at least two tiles ((P1, P2), (P'1, P'2)), said tiles being arranged on said support substrate (1, 3, S) in an incorrect distribution and/or geometry compared with a target distribution and/or geometry; - forming a mask comprising a protective film (M1, M2) that at least partially covers said tiles ((P1, P2), (P'1, P'2)) according to a pattern that defines the target distribution and/or geometry and at least one opening extending around the protective film (M1, M2); - etching at least one tile (P1, P2, P'1, P'2) through the opening in the mask so as to correct the arrangement of the tiles according to the target distribution and/or geometry.