Tiled Display Bonding Structure for Seamless Panel Integration
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Solution Overview
Problem
Large-size display devices face increased defect rates and decreased productivity due to the number of pixels, leading to seams between tiled display devices that disrupt image continuity and immersion.
Innovation Solution
A tiled display device design that reduces temperature and pressure for bonding flexible films, using a barrier insulating layer with protruding metal parts and a filler part to minimize non-display areas and seams, allowing for seamless integration of multiple display devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple display devices are connected to form a large-size display, then the screen size is increased, but seams appear between devices causing discontinuity perception
Solution Approach 1:
The patent extracts the bonding process parameters (temperature and pressure) to optimized levels, removing the excessive conditions that cause prominent seams. By taking out the harmful effects of high-temperature and high-pressure bonding, the seam visibility is reduced while maintaining the tiled display structure.
Solution Approach 2:
The patent applies parameter changes by optimizing the bonding temperature and pressure values. Specifically, it uses lower temperature (reducing thermal expansion differences) and controlled pressure during bonding, which minimizes seam formation and improves the visual continuity of the tiled display device.
2Strength
If flexible films are bonded using conventional temperature and pressure, then bonding strength is achieved, but seam visibility increases and manufacturing cost increases
Solution Approach 1:
The patent changes the bonding parameters (temperature and pressure) to optimized values that achieve sufficient bonding strength without requiring excessive conditions. This reduces manufacturing costs by avoiding high-energy bonding processes while maintaining adequate bond strength through precise parameter control.
Solution Approach 2:
The patent replaces conventional high-temperature and high-pressure mechanical bonding with a more efficient bonding mechanism that uses optimized, lower parameters. This substitution reduces energy consumption and manufacturing costs while achieving the required bonding strength through improved bonding process design.
3Reliability
If conventional bonding process is used for flexible films, then bonding is achieved, but temperature and pressure requirements increase manufacturing complexity
Solution Approach 1:
The patent optimizes bonding parameters to achieve reliable bonding at lower temperature and pressure levels. This simplifies the bonding process by reducing the complexity of temperature control and pressure application systems, while maintaining bonding reliability through precise parameter optimization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively minimizes the visibility of seams between display devices, enhancing image immersion and reducing manufacturing costs by using adhesive parts with low viscosity and high fluidity for efficient bonding.
Implementation Method 1
an adhesive part having an insulating property and attaching the flexible film to a bottom surface of the first barrier insulating layer
Data Source
AI summary
A display device includes a first barrier insulating layer including a first contact hole, a first metal layer disposed on the first barrier insulating layer, the first metal layer including a protruding part inserted in the first contact hole to protrude from below the first barrier insulating layer, and a recessed part formed in the first contact hole, a substrate disposed on the first metal layer and including a second contact hole, a second metal layer disposed on the substrate and inserted in the second contact hole to be connected to the first metal layer, a thin-film transistor including an active layer and a third metal layer overlapping the active layer, and a flexible film disposed below the first barrier insulating layer and including a lead electrode electrically connected to the protruding part of the first metal layer.