Tiled Display Through-Hole Layout for Seamless Module Boundaries
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Solution Overview
Problem
Large-sized display devices face increased defect rates and reduced productivity due to the number of pixels, leading to a sense of disconnection between tiled display units, which affects immersion and reliability.
Innovation Solution
A tiled display device design featuring an insulating layer with a mask portion overlapping the display area and alignment mark portions in non-display areas, along with a flexible film and source driver, to precisely adjust and minimize through holes, reducing the visibility of boundaries between units and improving process precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a large-sized display device is manufactured with increased number of pixels, then the display size is improved, but the defect rate increases and productivity deteriorates
Solution Approach 1:
The large display device is divided into multiple small display modules that are tiled together. Each module contains a reduced number of pixels, which maintains lower defect rates while collectively forming a large display area. The segmentation allows each module to be manufactured with high reliability and then assembled into a larger system.
2Area of stationary object
If multiple display devices are connected to form a tiled display, then the display size is improved, but boundary portions and non-display areas become visible reducing immersion
Solution Approach 1:
The non-display area and boundary portions are extracted and removed from the visible display region. The insulating layer with through-holes is positioned in the non-display area, allowing display elements to extend to the edges of each module. When tiled, the boundary portions are eliminated or minimized, creating a seamless visual experience across multiple modules.
Solution Approach 2:
The insulating layer and through-holes are moved to the non-display area dimension, separating the functional wiring structure from the visible display area. This dimensional separation allows the display elements to reach the physical boundaries of each module without visible seams, while the insulating structures remain hidden in the non-display region.
3Ease of manufacture
If through holes are made larger to facilitate manufacturing, then ease of manufacture is improved, but manufacturing precision deteriorates
Solution Approach 1:
The insulating layer is formed beforehand in the non-display area before the through-holes are created. This preliminary positioning provides precise alignment references for subsequent through-hole formation processes. The pre-formed insulating structures serve as guides that ensure accurate through-hole placement without requiring complex real-time alignment procedures.
Solution Approach 2:
The insulating layer acts as an intermediary structure that mediates between the substrate and the through-holes. It provides a stable reference framework that facilitates precise through-hole formation while maintaining manufacturing ease. The insulating layer's pre-defined geometry serves as a template that guides the through-hole creation process with high precision.
Data Source
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AI summary
A display device includes: a substrate including a display area and a non-display area, the substrate having a first portion of a through hole penetrating in a thickness direction thereof in the display area, an etching stopper on one surface of the substrate, the etching stopper having a second portion of the through hole connected to one end of the first portion of the through hole, a display layer on one surface of the etching stopper, and the display layer including a connection line on the second portion of the through hole, an insulating layer on other surface opposite to the one surface of the substrate, the insulating layer having a third portion of the through hole connected to the other end of the first portion of the through hole, and a pad unit on an other surface of the insulating layer and connected to the connection line.