Tiled Display Panel Wiring Layout Without Side Connection Lines
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Solution Overview
Problem
Tiled display devices face issues with dead spaces and reliability due to the complexity of manufacturing processes, including the formation of pads and connection lines on the rear and side surfaces of display panels, which can lead to deteriorated display quality and increased manufacturing complexity.
Innovation Solution
A display device design featuring a substrate with a groove and conductive pattern on its lower surface, eliminating the need for side surface connection lines by integrating the conductive pattern and bridge pattern through a contact hole, and using a flexible substrate with a simpler front surface manufacturing process, reducing dead spaces and enhancing reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If pads and connection lines are formed on the rear and side surfaces of display panels, then electrical connection is achieved, but manufacturing process complexity increases and reliability deteriorates
Solution Approach 1:
The patent combines the pad formation and connection line formation into a single front surface process. The conductive pattern is formed on the front surface of the display panel, eliminating the need for separate rear surface pad formation and side surface connection line formation processes. This merging of operations reduces manufacturing complexity and improves reliability by reducing the number of process steps and potential failure points.
Solution Approach 2:
The patent inverts the conventional approach by forming the conductive pattern on the front surface of the display panel instead of on the rear and side surfaces. This inversion allows the connection to be made from the front surface, which is the opposite of the traditional rear/side surface approach, thereby simplifying the manufacturing process and improving reliability.
2Reliability
If connection lines are exposed on the side surface of the display panel, then electrical connection is achieved, but reliability deteriorates
Solution Approach 1:
The patent extracts the connection line formation from the side surface and relocates it to the front surface. By taking out the problematic exposed side surface connection lines and reforming them as a conductive pattern on the front surface, the vulnerability associated with exposed connection lines is eliminated while maintaining the electrical connection function.
3Ease of manufacture
If multiple process steps are added for pad and connection line formation, then electrical connection is achieved, but manufacturing efficiency decreases
Solution Approach 1:
The patent merges multiple process steps (pad formation, connection line formation) into a single conductive pattern formation step on the front surface. This reduction in the number of process steps directly improves manufacturing efficiency by reducing cycle time and increasing productivity, while also simplifying the manufacturing process.
Data Source
AI summary
A display device includes a substrate having a lower surface on which a groove is formed, a conductive pattern disposed in the groove of the substrate, a bridge pattern disposed on the substrate and electrically connected to the conductive pattern through a contact hole passing through the substrate, a first insulating layer disposed on the substrate and covering the bridge pattern, a transistor disposed on the first insulating layer, a second insulating layer disposed on the substrate and covering the transistor, and a light emitting element disposed on the second insulating layer. The bridge pattern is electrically connected to the transistor or the light emitting element. A first valley is further formed on the lower surface of the substrate, the first valley and the groove being different from each other, and a conductive pattern is not disposed in the first valley.