Tiling Display Chip Bonding Layout for Narrow Seam Alignment
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Solution Overview
Problem
The challenge of achieving high tiling accuracy in display panels to minimize slits and image discontinuity in tiling display apparatuses, which affects display quality.
Innovation Solution
A tiling display apparatus design with substrate and adhesive layer openings corresponding to display units, allowing driver chips to be bonded through these openings, which also serve as alignment marks, enhancing tiling accuracy and reducing gaps between units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If display panels are tiled to form large display apparatus, then installation cost and maintenance cost are reduced, but slits between display panels are formed resulting in image discontinuity
Solution Approach 1:
The driver chip is embedded within the display panel structure, specifically positioned in a recessed region of the circuit substrate. This nesting approach integrates the driver chip into the panel itself, allowing the driving circuit to be part of the tiled unit, which enables tighter tiling accuracy while maintaining cost benefits of modular assembly
Solution Approach 2:
A bonding pad is introduced as an intermediary element between the driver chip and the light emitting devices. This bonding pad facilitates precise electrical connection and positioning, enabling the driver chip to be accurately aligned and bonded to control the light emitting devices, thereby improving tiling precision
2Ease of manufacture
If display panels are tiled to reduce cost, then installation and maintenance become more economical, but image discontinuity and dark lines increase
Solution Approach 1:
The driver chip is nested within the display panel structure in a recessed region, making the driving circuit an integral part of the tiled unit. This integration eliminates external connections that could cause image discontinuity, thereby improving display quality while maintaining the modular cost benefits
Solution Approach 2:
The driving circuit (driver chip) is merged with the display panel structure by embedding it within the panel's recessed region. This combination creates a unified tiled unit where the driver and display elements work as one integrated component, reducing image discontinuity and enhancing overall display quality
3Reliability
If driver chips are bonded to display units, then electrical connection is achieved, but tiling gaps increase reducing tiling accuracy
Solution Approach 1:
The driver chip is nested within a recessed region of the circuit substrate, allowing the chip to be positioned in a depression that reduces its protrusion height. This nesting enables the driver chip to be bonded with minimal tiling gap, achieving both reliable electrical connection and high tiling precision
Solution Approach 2:
The circuit substrate is designed with a recessed region at the specific location where the driver chip will be bonded. This local structural modification creates a depression that accommodates the driver chip, reducing the overall height difference and tiling gap at the bonding location while maintaining the integrity of the rest of the panel
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves tiling accuracy, reducing display unit gaps and minimizing image discontinuities, thereby enhancing the overall display quality.
Implementation Method 1
The adhesive layer connects the substrate and the display units
Data Source
AI summary
A tiling display apparatus including a substrate, multiple display units, an adhesive layer and multiple driver chips is provided. The display units are disposed on the substrate and each has a circuit substrate, multiple light emitting devices and at least one bonding pad. The circuit substrate has a first surface and a second surface opposite to each other. The light emitting devices are disposed on the first surface. The at least one bonding pad is disposed on the second surface, and is electrically coupled to the light emitting devices. The adhesive layer connects the substrate and the display units. The substrate and the adhesive layer have a plurality of openings arranged corresponding to the openings. Multiple bonding pads of the display units are positioned in the openings. The driver chips are electrically bonded to the bonding pads of the display units through the openings.